{"title":"Study on the Bearing Capacity of the Polyethylene Pipe–Cured-In-Place Pipe Liner Composite Structure under External Pressure","authors":"Xinyi Wang, Cong Zeng, Xuefeng Yan, Peng Zhang","doi":"10.3390/buildings14072253","DOIUrl":null,"url":null,"abstract":"Cured-in-place pipe (CIPP) technology is used to repair deformed municipal polyethylene (PE) pipes caused by design flaws, construction issues, or external loads. However, research on CIPP for PE pipes is limited, restricting its broader application. This research focuses on the mechanical response characteristics and failure modes of the composite PE pipe–CIPP liner structure under external loads. Using experimental setups involving comparative test groups with different diameters and wall thickness ratios (DR values, defined as the ratio of the pipe’s outer diameter to its wall thickness), this study evaluates the effects of the liner’s elastic modulus, the bonding effectiveness at the PE pipe–CIPP liner interface, and the initial ovality of the pipes on the load-bearing capacity. The experimental results reveal that CIPP liners substantially enhance the stiffness and load-bearing capacity of PE pipes, with improvements ranging from 200% to nearly 500% depending on the pipe’s DR value. A novel ring stiffness prediction model is also introduced and validated against the experimental data. This model provides a theoretical framework for understanding the complex interactions at the PE pipe–CIPP liner interface and aids in designing more resilient urban drainage systems.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"21 17","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/buildings14072253","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Cured-in-place pipe (CIPP) technology is used to repair deformed municipal polyethylene (PE) pipes caused by design flaws, construction issues, or external loads. However, research on CIPP for PE pipes is limited, restricting its broader application. This research focuses on the mechanical response characteristics and failure modes of the composite PE pipe–CIPP liner structure under external loads. Using experimental setups involving comparative test groups with different diameters and wall thickness ratios (DR values, defined as the ratio of the pipe’s outer diameter to its wall thickness), this study evaluates the effects of the liner’s elastic modulus, the bonding effectiveness at the PE pipe–CIPP liner interface, and the initial ovality of the pipes on the load-bearing capacity. The experimental results reveal that CIPP liners substantially enhance the stiffness and load-bearing capacity of PE pipes, with improvements ranging from 200% to nearly 500% depending on the pipe’s DR value. A novel ring stiffness prediction model is also introduced and validated against the experimental data. This model provides a theoretical framework for understanding the complex interactions at the PE pipe–CIPP liner interface and aids in designing more resilient urban drainage systems.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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Web of Science SCIE
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CAS
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