Shape Memory Polymers in 4D Printing: Investigating Multi-Material Lattice Structures

IF 4.7 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-07-22 DOI:10.3390/jmmp8040154

David Pokras, Yanika Schneider, Sohail H. Zaidi, Vimal K. Viswanathan

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Abstract

This paper evaluates the design and fabrication of a thermoplastic polyurethane (TPU) shape memory polymer (SMP) using fused deposition modeling (FDM). The commercially available SMP filament was used to create parts capable of changing their shape following the application of an external heat stimulus. The characterization of thermal and viscoelastic properties of the SMP TPU revealed a proportional change in shape fixity and recovery with respect to heating and cooling rates, as well as a decreasing softening temperature with increasing shape memory history due to changes in the polymer microstructure. Inspired by the advancements in 3D and 4D printing, we investigated the feasibility of creating multi-material lattice structures using SMP and another thermoplastic with poor adhesion to TPU. A variety of interlocking lattice structures were evaluated by combining SMP with another thermoplastic that have poor adhesion with TPU. The tensile strength and failure modes of the fabricated multi-material parts were compared against homogenous SMP TPU specimens. It was found that the lattice interface failed first at approximately 41% of the ultimate strength of the homogenous part on average. The maximum recorded ultimate strength of the multi-material specimens reached 62% of SMP TPU’s ultimate strength. These characterizations can make 4D printing technology more accessible to common users and make it available for new markets.

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4D 打印中的形状记忆聚合物：研究多材料晶格结构

本文评估了使用熔融沉积建模（FDM）设计和制造热塑性聚氨酯（TPU）形状记忆聚合物（SMP）的情况。商用 SMP 长丝用于制造在外部热刺激下能够改变形状的部件。对 SMP 热塑性聚氨酯的热性能和粘弹性能进行表征后发现，由于聚合物微观结构的变化，其形状固定性和恢复性随加热和冷却速率的变化成比例变化，软化温度随形状记忆历史的增加而降低。受三维和四维打印技术进步的启发，我们研究了使用 SMP 和另一种与热塑性聚氨酯粘附性较差的热塑性塑料创建多材料晶格结构的可行性。通过将 SMP 与另一种与热塑性聚氨酯粘附性较差的热塑性塑料相结合，我们对各种互锁晶格结构进行了评估。与同质的 SMP 热塑性聚氨酯试样相比，对制造的多材料部件的拉伸强度和失效模式进行了比较。结果发现，晶格界面首先失效，平均失效强度约为同质部件极限强度的 41%。多材料试样记录的最大极限强度达到 SMP TPU 极限强度的 62%。这些特性分析可以让普通用户更容易获得 4D 打印技术，并将其推向新的市场。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico

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