Evidence of Widely Distributed Time Constants in the Vertical Charge Loss of 3-D Charge-Trap NAND Flash Memories

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-07-29 DOI:10.1109/LED.2024.3435345
David G. Refaldi;Gerardo Malavena;Luca Chiavarone;Alessandro S. Spinelli;Christian Monzio Compagnoni
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Abstract

In this letter, through experimental evidence collected at room temperature and in the deep-cryogenic regime, we demonstrate that the so-called vertical charge loss from the gate stack of 3-D charge-trap NAND Flash memories is a process featuring widely distributed time constants. Results reveal that the turn-on of these time constants depends on the temperature at which the program operation is carried out. This, combined with the dependence of the time constants on the temperature at which vertical charge loss is monitored, gives rise to an apparent activation energy of the cell threshold-voltage transient during data retention that is close to zero when data retention and program occur at the same temperature. This phenomenology must be carefully taken into account when trying to extend the working temperature of NAND Flash memories down to the deep-cryogenic regime.
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三维电荷捕获 NAND 闪存垂直电荷损耗中广泛分布的时间常数证据
在这封信中,通过在室温和深低温条件下收集的实验证据,我们证明了所谓的三维电荷陷阱 NAND 闪存栅极堆栈垂直电荷损耗是一个具有广泛分布时间常数的过程。结果表明,这些时间常数的开启取决于进行编程操作时的温度。这一点与时间常数对垂直电荷损耗监测温度的依赖性相结合,导致在数据保持过程中,当数据保持和编程在同一温度下进行时,单元阈值电压瞬态的表面活化能接近于零。在尝试将 NAND 闪存的工作温度降低到深冷状态时,必须仔细考虑这一现象。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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Table of Contents Front Cover IEEE Electron Device Letters Publication Information IEEE Electron Device Letters Information for Authors Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices
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