Defect Microstructure Evolution in an Immiscible Composite Cu43%Cr Alloy After High-Pressure Torsion and Annealing Using Positron Annihilation Spectroscopy

IF 3.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Metals and Materials International Pub Date : 2024-08-03 DOI:10.1007/s12540-024-01745-2
I. Bibimoune, E. Hirschmann, M. O. Liedke, A. Wagner, M. Kawasaki, T. Baudin, I. Mkinsi, K. Abib, Y. Huang, T. G. Langdon, D. Bradai
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Abstract

The microstructure of a Cu43%Cr alloy after high-pressure torsion (HPT) processing and annealing for 1 h was analyzed using Doppler broadening – variable energy PAS (DB-VEPAS) and conventional positron annihilation lifetime spectroscopy (cPALS). DB-VEPAS analysis of the near-surface defects reveals the existence of a nanosized oxide layer whose thickness increases from 43 to 103 nm with temperature (210–850 °C) while the diffusion length is unaffected around 20 nm. cPALS analysis revealed two lifetime components of the bulk defects, namely the components related to either vacancies or dislocations, for the as-received material with annealing at 925 °C. After HPT processing, the alloy showed two components which correspond to positrons trapped and annihilated at dislocations (lifetime ̴ 160 ps) in Cu and Cr and at clusters of vacancies (about 13–10 vacancies). The intensity of the first component decreases with increasing annealing temperatures from 210 to 850 °C, thereby implying a partial annihilation of dislocations due to microstructure recovery. The variation of the second component depends on the variation of vacancy cluster size (from about 13 and 10 to about 4 vacancies) resulting from different annealing temperatures. Additionally, Vickers microhardness measurements show that the alloy is substantially hardened after processing by HPT for N = 20 turns. After annealing for 1 h at 210, 550 and 850 °C, the HPT-processed alloy after 5 turns demonstrated a gradual softening by microstructural recovery. Annealing-induced hardening is observed after HPT for 20 turns followed by heating up to 550 °C while softening is observed after annealing at 850 °C.

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利用正电子湮没能谱分析不相溶复合铜 43%Cr 合金在高压扭转和退火后的缺陷微观结构演变
使用多普勒展宽-变能 PAS(DB-VEPAS)和传统正电子湮灭寿命光谱(cPALS)分析了经过高压扭转(HPT)处理和 1 小时退火后的 Cu43%Cr 合金的微观结构。对近表面缺陷的 DB-VEPAS 分析表明,存在纳米级氧化层,其厚度随温度(210-850 °C)的升高从 43 纳米增加到 103 纳米,而扩散长度在 20 纳米左右不受影响。经过 HPT 处理后,合金显示出两个分量,分别对应于在铜和铬的位错(寿命 ̴ 160 ps)和空位簇(约 13-10 个空位)处捕获和湮灭的正电子。第一个分量的强度随着退火温度从 210 ℃ 到 850 ℃ 的升高而降低,这意味着由于微观结构的恢复,位错发生了部分湮灭。第二个分量的变化取决于不同退火温度下空位簇大小的变化(从约 13 个和 10 个空位到约 4 个空位)。此外,维氏硬度测量结果表明,通过 HPT 处理 N = 20 圈后,合金已基本硬化。在 210、550 和 850 ℃ 下退火 1 小时后,HPT 加工 5 圈后的合金通过微观结构恢复而逐渐软化。HPT 20 圈后加热至 550 °C,观察到退火诱导硬化,而在 850 °C退火后观察到软化。
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来源期刊
Metals and Materials International
Metals and Materials International 工程技术-材料科学:综合
CiteScore
7.10
自引率
8.60%
发文量
197
审稿时长
3.7 months
期刊介绍: Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.
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