RF Performance Augmentation Using DG-InAlN/GaN HEMT

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-08-01 DOI:10.1109/TED.2024.3430251
Vandana Kumari;Manoj Saxena;Mridula Gupta
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Abstract

The work presented in this study examines the behavior of InAlN/GaN high electron mobility transistor (HEMT) by scaling down the device geometry, including the gate length and barrier thickness, at various operating temperatures. Extensive simulation has been performed using Silvaco’s Victory TCAD simulator tool to analyze the dc and RF performance of InAlN HEMT in terms of ${I}_{\text {on}}/{I}_{\text {off}}$ , intrinsic gain, DIBL, and cutoff frequency. To strengthen the RF performance at increased device length, dual gate (DG) architecture [i.e., Gate 1 (G1) and Gate 2 (G2)] has been adopted, and different gate biasing combinations have been used to investigate the device performance. A tradeoff among intrinsic gain and cutoff frequency is noted from the results. An increment in the cutoff frequency of nearly 57% has been obtained with the introduction of DG along with a deterioration in intrinsic gain.
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使用 DG-InAlN/GaN HEMT 提升射频性能
本研究通过缩小器件的几何尺寸(包括栅极长度和势垒厚度),研究了 InAlN/GaN 高电子迁移率晶体管 (HEMT) 在不同工作温度下的性能。我们使用 Silvaco 的 Victory TCAD 仿真工具进行了广泛的仿真,从 ${I}_{text {on}}/{I}_{\text {off}}$ 、本征增益、DIBL 和截止频率等方面分析了 InAlN HEMT 的直流和射频性能。为了加强器件长度增加时的射频性能,我们采用了双栅极(DG)结构[即栅极 1 (G1) 和栅极 2 (G2)],并使用不同的栅极偏压组合来研究器件性能。结果表明,本征增益和截止频率之间存在权衡。引入栅极偏置后,截止频率提高了近 57%,但本征增益却有所下降。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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