{"title":"Effect of Source/Drain Electrode Materials on the Electrical Performance and Stability of Amorphous Indium-Tin-Zinc-Oxide FETs","authors":"Seong Ui An;Dae-Hwan Ahn;Gijun Ju;Simin Chen;Yo Seop Ji;Jae-Hoon Han;Jaekyun Kim;Younghyun Kim","doi":"10.1109/TED.2024.3433831","DOIUrl":null,"url":null,"abstract":"The gate-bias stability of amorphous indium-tin-zinc-oxide (a-ITZO) field-effect transistors (FETs) is critical for their display and emerging memory applications. However, a-ITZO FETs suffer from insufficient gate-bias stability induced by oxygen vacancies in the channel layer. To address this issue, we examined the impact of source/drain (S/D) electrode materials (W, Mo, and Ni) on the oxygen vacancy formation and electrical characteristics in the a-ITZO FETs. Through X-ray photoelectron spectroscopy (XPS) analysis, we found that the Ni S/D electrode is effective in forming fewer oxygen vacancies in the a-ITZO channel, whereas W and Mo induce many oxygen vacancies. Our proposed model suggests that the Ni electrode absorbing less oxygen from the a-ITZO films compared to other electrodes leads to fewer oxygen vacancies in the a-ITZO channel. Notably, the a-ITZO FETs incorporating Ni S/D electrodes exhibit not only excellent electrical performance, including a high field-effect mobility of 27.6 cm2/Vs, a steep subthreshold swing (SS) of 71.8 mV/decade, and high on/off ratio of \n<inline-formula> <tex-math>$\\sim 10^{{7}}$ </tex-math></inline-formula>\n, but also an outstanding gate-bias stability (\n<inline-formula> <tex-math>$\\Delta V_{\\text {th}} = -0.04$ </tex-math></inline-formula>\n V) under negative bias stress (NBS) testing. These findings underscore the potential of Ni S/D electrodes in advancing the development of high-performance, stable a-ITZO FETs for the next-generation semiconductor devices.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10620402/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The gate-bias stability of amorphous indium-tin-zinc-oxide (a-ITZO) field-effect transistors (FETs) is critical for their display and emerging memory applications. However, a-ITZO FETs suffer from insufficient gate-bias stability induced by oxygen vacancies in the channel layer. To address this issue, we examined the impact of source/drain (S/D) electrode materials (W, Mo, and Ni) on the oxygen vacancy formation and electrical characteristics in the a-ITZO FETs. Through X-ray photoelectron spectroscopy (XPS) analysis, we found that the Ni S/D electrode is effective in forming fewer oxygen vacancies in the a-ITZO channel, whereas W and Mo induce many oxygen vacancies. Our proposed model suggests that the Ni electrode absorbing less oxygen from the a-ITZO films compared to other electrodes leads to fewer oxygen vacancies in the a-ITZO channel. Notably, the a-ITZO FETs incorporating Ni S/D electrodes exhibit not only excellent electrical performance, including a high field-effect mobility of 27.6 cm2/Vs, a steep subthreshold swing (SS) of 71.8 mV/decade, and high on/off ratio of
$\sim 10^{{7}}$
, but also an outstanding gate-bias stability (
$\Delta V_{\text {th}} = -0.04$
V) under negative bias stress (NBS) testing. These findings underscore the potential of Ni S/D electrodes in advancing the development of high-performance, stable a-ITZO FETs for the next-generation semiconductor devices.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.