Accurate numerical simulations of capillary underfill process for flip-chip packages

IF 8.7 2区 工程技术 Q1 Mathematics Engineering with Computers Pub Date : 2024-08-03 DOI:10.1007/s00366-024-02022-x
Yu-Chi Cheng, Yu-Hsien Chen, Hao-Hsi Hung, Sheng-Jye Hwang, Dao-Long Chen, Hui-Jing Chang, Bing-Yuan Huang, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hung
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Abstract

In the capillary underfill packaging process, resin with specific characteristics such as low viscosity, high flowability, fast curing, and high reliability is utilized to fill the gaps between the substrate and the die. This underfill resin serves to reinforce the connections between metal bumps and the substrate, thereby extending the lifespan and enhancing the reliability of FCBGA (Flip-Chip Ball Grid Array) packages. Despite the availability of flow simulation tools, the development of the underfill process remains a significant challenge for engineers due to the multitude of control parameters involved. The objective of this study is to identify the key factors influencing the accuracy of underfill flow simulations and explore potential solutions to these challenges. In this study, it is found that necessary ingredients for accurate underfill simulation need to include the following items: 1. Good flow simulation software 2. Accurately measured material properties 3. Good and fine mesh 4. Right amount of dispensed resin 5. Right timing for resin dispensing. The accuracy of the simulation is particularly affected by factors such as overflowing, resin climbing, non-uniform flow, and air trapping, which are influenced by the amount and timing of resin dispensing. By addressing these factors, this study demonstrates that accurate underfill simulation can be achieved, providing valuable insights into microscale flip-chip underfill physics. This research lays the groundwork for the development of validated models applicable to next-generation high-density flip-chip products.

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倒装芯片封装毛细管底部填充工艺的精确数值模拟
在毛细管底部填充封装工艺中,具有低粘度、高流动性、快速固化和高可靠性等特性的树脂被用来填充基板和芯片之间的间隙。这种底部填充树脂可加强金属凸点与基板之间的连接,从而延长 FCBGA(倒装芯片球栅阵列)封装的使用寿命并提高其可靠性。尽管有了流动模拟工具,但由于涉及众多控制参数,底层填充工艺的开发对工程师来说仍是一项重大挑战。本研究的目的是找出影响底部填充流动模拟准确性的关键因素,并探索应对这些挑战的潜在解决方案。在这项研究中,我们发现精确的底部填充模拟需要包括以下必要因素:1.良好的流动模拟软件 2.精确测量的材料属性 3.良好且精细的网格 4.正确的树脂分配量 5.正确的树脂分配时间。溢出、树脂爬升、不均匀流动和空气截留等因素都会影响模拟的准确性,而这些因素又会受到树脂分配量和分配时机的影响。通过解决这些因素,本研究证明可以实现精确的底部填充模拟,为微米级倒装芯片底部填充物理学提供了宝贵的见解。这项研究为开发适用于下一代高密度倒装芯片产品的验证模型奠定了基础。
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来源期刊
Engineering with Computers
Engineering with Computers 工程技术-工程:机械
CiteScore
16.50
自引率
2.30%
发文量
203
审稿时长
9 months
期刊介绍: Engineering with Computers is an international journal dedicated to simulation-based engineering. It features original papers and comprehensive reviews on technologies supporting simulation-based engineering, along with demonstrations of operational simulation-based engineering systems. The journal covers various technical areas such as adaptive simulation techniques, engineering databases, CAD geometry integration, mesh generation, parallel simulation methods, simulation frameworks, user interface technologies, and visualization techniques. It also encompasses a wide range of application areas where engineering technologies are applied, spanning from automotive industry applications to medical device design.
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