Investigation of mechanical behavior of porous carbon-based matrix by molecular dynamics simulation: Effects of Si doping

IF 2.7 4区 生物学 Q2 BIOCHEMICAL RESEARCH METHODS Journal of molecular graphics & modelling Pub Date : 2024-07-31 DOI:10.1016/j.jmgm.2024.108836
Weifeng Ma , Ali Basem , Soheil Salahshour , Zainab Younus Abdullah , Mohammed Al-Bahrani , Raman Kumar , Sh. Esmaeili
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Abstract

Understanding the mechanical properties of porous carbon-based materials can lead to advancements in various applications, including energy storage, filtration, and lightweight structural components. Also, investigating how silicon doping affects these materials can help optimize their mechanical properties, potentially improving strength, durability, and other performance metrics. This research investigated the effects of atomic doping (Si particle up to 10 %) on the mechanical properties of the porous carbon matrix using molecular dynamics methods. Young's modulus, ultimate strength, radial distribution function, interaction energy, mean square displacement and potential energy of designed samples were reported. MD outputs predict the Si doping process improved the mechanical performance of porous structures. Numerically, Young's modulus of the C-based porous matrix increased from 234.33 GPa to 363.82 GPa by 5 % Si inserted into a pristine porous sample. Also, the ultimate strength increases from 48.54 to 115.93 GPa with increasing Si doping from 1 % to 5 %. Silicon doping enhances the bonding strength and reduces defects in the carbon matrix, leading to improved stiffness and load-bearing capacity. This results in significant increases in mechanical performance. However, excess Si may disrupt the optimal bonding network, leading to weaker connections within the matrix. Also, considering the negative value of potential energy in different doping percentages, it can be concluded that the amount of doping added up to 10 % does not disturb the initial structure and stability of the system, and the structure still has structural stability. So, we expected our introduced atomic samples to be used in actual applications.

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通过分子动力学模拟研究多孔碳基基质的力学行为:硅掺杂的影响
了解多孔碳基材料的机械性能可以促进各种应用的发展,包括能量存储、过滤和轻质结构组件。此外,研究硅掺杂对这些材料的影响有助于优化其机械性能,从而提高强度、耐用性和其他性能指标。这项研究采用分子动力学方法,研究了原子掺杂(硅颗粒高达 10%)对多孔碳基体机械性能的影响。报告了设计样品的杨氏模量、极限强度、径向分布函数、相互作用能、均方位移和势能。MD 输出结果预测,掺硅过程改善了多孔结构的机械性能。从数值上看,在原始多孔样品中掺入 5% 的硅后,C 基多孔基体的杨氏模量从 234.33 GPa 增加到 363.82 GPa。此外,随着掺硅量从 1 % 增加到 5 %,极限强度也从 48.54 GPa 增加到 115.93 GPa。掺硅增强了结合强度,减少了碳基体中的缺陷,从而提高了刚度和承载能力。这就大大提高了机械性能。然而,过量的硅可能会破坏最佳的键合网络,导致基体内部的连接减弱。此外,考虑到不同掺杂百分比下的势能负值,可以得出结论:掺杂量达到 10 % 不会破坏系统的初始结构和稳定性,该结构仍然具有结构稳定性。因此,我们希望我们推出的原子样品能在实际应用中得到应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of molecular graphics & modelling
Journal of molecular graphics & modelling 生物-计算机:跨学科应用
CiteScore
5.50
自引率
6.90%
发文量
216
审稿时长
35 days
期刊介绍: The Journal of Molecular Graphics and Modelling is devoted to the publication of papers on the uses of computers in theoretical investigations of molecular structure, function, interaction, and design. The scope of the journal includes all aspects of molecular modeling and computational chemistry, including, for instance, the study of molecular shape and properties, molecular simulations, protein and polymer engineering, drug design, materials design, structure-activity and structure-property relationships, database mining, and compound library design. As a primary research journal, JMGM seeks to bring new knowledge to the attention of our readers. As such, submissions to the journal need to not only report results, but must draw conclusions and explore implications of the work presented. Authors are strongly encouraged to bear this in mind when preparing manuscripts. Routine applications of standard modelling approaches, providing only very limited new scientific insight, will not meet our criteria for publication. Reproducibility of reported calculations is an important issue. Wherever possible, we urge authors to enhance their papers with Supplementary Data, for example, in QSAR studies machine-readable versions of molecular datasets or in the development of new force-field parameters versions of the topology and force field parameter files. Routine applications of existing methods that do not lead to genuinely new insight will not be considered.
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