Machine learning-based approach for predicting the compressive strength of 3D printed hexagon lattice-cored sandwich structures

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-08-10 DOI:10.1177/08927057241270791
Narain kumar Sivakumar, Kaaviya J, Sabarinathan Palaniyappan, Mohammed Azeem P, S. Basavarajappa, Ihab M. Moussa, Mohamed Ibrahim Hashem
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Abstract

The utilization of Fused Filament Fabrication (FFF) technology for developing sandwich structures proves to be an effective approach, enabling the rapid construction of intricate profiles and gaining widespread recognition for diverse structural applications. In this study, hexagon lattice-cored sandwich structures are created by situating the lattice core at the center of the PLA polymeric specimens. The performance is assessed by varying 3D-Printing Factors (3D-PFs), including Nozzle Temperature (NT), Layer Height (LH), Printing Speed (PS), and Line Width (LW). The levels of 3D-PFs are manipulated as follows: NT (180, 190, 200, 210°C), LH (0.15, 0.2, 0.25, 0.3 mm), PS (15, 20, 25, 30 mm/sec), and LW (0.1, 0.2, 0.3, 0.4 mm). By employing a FFF 3D printer, the sandwich specimens are 3D-printed and their compression properties are assessed using a Universal Testing Machine (UTM). In this research, various Machine Learning (ML) models namely Bayesian Ridge regression (BRid), Elastic Net linear regression (EN), Quantile Regression (QR), and Support Vector Machine (SVM) are utilized to predict the compressive strength/density property of the developed sandwich structure. This aids in determining the optimal levels of 3D-PFs to achieve enhanced compressive strength/density. The results reveal that the QR model, particularly when employed in the boosting ensemble technique, exhibits superior accuracy with a Root Mean Square Error (RMSE) of 0.26 × 104, Mean Absolute Error (MAE) of 0.21 × 104, and Median Absolute Error (MedAE) of 0.16 × 104. Utilizing the QR model within the boosting ensemble technique, the influence of 3D-PFs on resulting compressive strength/density is analyzed, facilitating the identification of optimized 3D-PF levels for improved compressive strength/density. Sandwich structures fabricated at these optimized levels demonstrate enhanced compressive properties, making them suitable for a variety of structural applications.
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基于机器学习的 3D 打印六边形格子夹层结构抗压强度预测方法
事实证明,利用熔融长丝制造(FFF)技术开发夹层结构是一种有效的方法,能够快速构建复杂的轮廓,并在各种结构应用中获得广泛认可。在本研究中,通过将晶格核心置于聚乳酸聚合物试样的中心,创建了六边形晶格夹层结构。通过改变三维打印因子(3D-PFs),包括喷嘴温度(NT)、层高(LH)、打印速度(PS)和线宽(LW),对其性能进行了评估。3D-PFs的水平控制如下:NT(180、190、200、210°C)、LH(0.15、0.2、0.25、0.3 毫米)、PS(15、20、25、30 毫米/秒)和 LW(0.1、0.2、0.3、0.4 毫米)。通过使用 FFF 三维打印机,夹层试样被三维打印出来,并使用万能试验机(UTM)对其压缩性能进行评估。在这项研究中,使用了各种机器学习(ML)模型,即贝叶斯岭回归(BRid)、弹性网线性回归(EN)、量子回归(QR)和支持向量机(SVM)来预测所开发夹层结构的抗压强度/密度特性。这有助于确定 3D-PF 的最佳水平,以实现更高的抗压强度/密度。结果表明,QR 模型,尤其是在增强集合技术中使用时,表现出卓越的准确性,均方根误差 (RMSE) 为 0.26 × 104,平均绝对误差 (MAE) 为 0.21 × 104,中位绝对误差 (MedAE) 为 0.16 × 104。利用增强集合技术中的 QR 模型,分析了 3D-PF 对所产生的抗压强度/密度的影响,从而确定了优化的 3D-PF 水平,以提高抗压强度/密度。在这些优化水平下制造的夹层结构显示出更强的抗压性能,使其适用于各种结构应用。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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