Design and analysis of a decoupled three‐phase coil array for inductive power transfer systems

IF 1.7 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IET Power Electronics Pub Date : 2024-08-10 DOI:10.1049/pel2.12762
Osama A. Almulla, D. Thrimawithana, Grant A. Covic, Seho Kim
{"title":"Design and analysis of a decoupled three‐phase coil array for inductive power transfer systems","authors":"Osama A. Almulla, D. Thrimawithana, Grant A. Covic, Seho Kim","doi":"10.1049/pel2.12762","DOIUrl":null,"url":null,"abstract":"This article details the design process for a new three‐phase coil array. All of the coils are made to be mutually decoupled from one another which is achieved by introducing a high reluctance path in the ferrite structure for mutual flux using an airgap in addition to controlling the coil overlap. Simulation and experimental results of a matched three‐phase primary and secondary coupler, designed using the proposed novel decoupling mechanism, are presented to show that the high reluctance path introduced to decouple the coils still allows the main couplings to be maintained within an acceptable range. In contrast, negligible interphase couplings between coils in the primary or secondary were observed. Effective coupling, voltage and uncompensated power measurements are shown to verify the design is able to meet SAE J2954 WPT3 requirements. Finally, the leakage magnetic flux density, simulated under WPT3 conditions, shows that its RMS value remains significantly less than 27 µT at a 800 mm distance from the centre of the secondary coupler.","PeriodicalId":56302,"journal":{"name":"IET Power Electronics","volume":null,"pages":null},"PeriodicalIF":1.7000,"publicationDate":"2024-08-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1049/pel2.12762","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This article details the design process for a new three‐phase coil array. All of the coils are made to be mutually decoupled from one another which is achieved by introducing a high reluctance path in the ferrite structure for mutual flux using an airgap in addition to controlling the coil overlap. Simulation and experimental results of a matched three‐phase primary and secondary coupler, designed using the proposed novel decoupling mechanism, are presented to show that the high reluctance path introduced to decouple the coils still allows the main couplings to be maintained within an acceptable range. In contrast, negligible interphase couplings between coils in the primary or secondary were observed. Effective coupling, voltage and uncompensated power measurements are shown to verify the design is able to meet SAE J2954 WPT3 requirements. Finally, the leakage magnetic flux density, simulated under WPT3 conditions, shows that its RMS value remains significantly less than 27 µT at a 800 mm distance from the centre of the secondary coupler.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
设计和分析用于电感式功率传输系统的去耦三相线圈阵列
本文详细介绍了新型三相线圈阵列的设计过程。除了控制线圈重叠外,还通过在铁氧体结构中引入高磁阻路径,利用气隙实现互通,从而使所有线圈相互去耦。本文介绍了利用拟议的新型去耦机制设计的匹配三相初级和次级耦合器的仿真和实验结果,结果表明,为使线圈去耦而引入的高磁阻路径仍可使主耦合保持在可接受的范围内。相比之下,初级或次级线圈之间的相间耦合可以忽略不计。有效耦合、电压和未补偿功率测量结果表明,该设计能够满足 SAE J2954 WPT3 的要求。最后,在 WPT3 条件下模拟的漏磁通密度显示,在距离次级耦合器中心 800 毫米处,其有效值仍明显小于 27 µT。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IET Power Electronics
IET Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
5.50
自引率
10.00%
发文量
195
审稿时长
5.1 months
期刊介绍: IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes: Applications: Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances. Technologies: Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies. Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials. Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems. Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques. Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material. Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest. Special Issues. Current Call for papers: Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf
期刊最新文献
Design and analysis of a decoupled three‐phase coil array for inductive power transfer systems Active elimination of DC bias current of a SiC based dual active bridge by controlling the dead time period Front Cover: A comparative analysis of power pulsating buffer architectures for mitigating high-frequency and low-frequency ripple in PV microinverter applications Stochastic weather simulation based on gate recurrent unit and generative adversarial networks An improved wireless power transmission system for micro unmanned aerial vehicles
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1