Glass-Aluminium Partition Walls with High-Damping Rubber Devices: Seismic Design and Numerical Analyses

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-08-08 DOI:10.3390/buildings14082445
F. Scozzese, A. Zona, A. Dall’Asta
{"title":"Glass-Aluminium Partition Walls with High-Damping Rubber Devices: Seismic Design and Numerical Analyses","authors":"F. Scozzese, A. Zona, A. Dall’Asta","doi":"10.3390/buildings14082445","DOIUrl":null,"url":null,"abstract":"An innovative solution for aluminium-glass partition walls that can withstand seismic actions without damage is presented. The key feature characterising the proposed innovation is a dissipative coupling between the components of the partition wall, i.e., the glass plates and the surrounding aluminium frame, accomplished through the interposition of high-damping rubber pads (HDRPs). Sliding mechanisms between glass panels and the aluminium frame are permitted through specific detailing solutions, which allow the partition wall to be unsensitive to the inter-storey drift imposed by the hosting structure. A detailed discussion of the system conception is illustrated, showing the main intermediate steps that led to the final solution. The implementation of a refined numerical model is illustrated, and its characteristic parameters are calibrated according to a set of experimental tests previously performed on materials and subcomponents. A numerical application to a case study consisting of a partition wall system installed within a three-storey building is provided to assess the performance of the proposed innovative solution under severe earthquakes.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"25 3","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/buildings14082445","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

An innovative solution for aluminium-glass partition walls that can withstand seismic actions without damage is presented. The key feature characterising the proposed innovation is a dissipative coupling between the components of the partition wall, i.e., the glass plates and the surrounding aluminium frame, accomplished through the interposition of high-damping rubber pads (HDRPs). Sliding mechanisms between glass panels and the aluminium frame are permitted through specific detailing solutions, which allow the partition wall to be unsensitive to the inter-storey drift imposed by the hosting structure. A detailed discussion of the system conception is illustrated, showing the main intermediate steps that led to the final solution. The implementation of a refined numerical model is illustrated, and its characteristic parameters are calibrated according to a set of experimental tests previously performed on materials and subcomponents. A numerical application to a case study consisting of a partition wall system installed within a three-storey building is provided to assess the performance of the proposed innovative solution under severe earthquakes.
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带高阻尼橡胶装置的玻璃-铝隔墙:抗震设计与数值分析
本文介绍了一种可承受地震作用而不受损害的铝玻璃隔墙创新解决方案。所提出的创新方案的主要特点是通过高阻尼橡胶垫(HDRP)实现隔断墙组件(即玻璃板和周围的铝框架)之间的消能耦合。玻璃板和铝框架之间的滑动机制通过特定的细部设计方案得以实现,从而使隔断墙对主体结构施加的层间漂移不敏感。图中详细讨论了系统构思,展示了最终解决方案的主要中间步骤。图中说明了细化数值模型的实施情况,并根据之前对材料和子组件进行的一系列实验测试校准了其特征参数。还提供了一个案例研究的数值应用,包括安装在一栋三层建筑内的隔墙系统,以评估所提出的创新解决方案在严重地震下的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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