Over 1 A Operation of Vertical-Type Diamond MOSFETs

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-08-07 DOI:10.1109/LED.2024.3427423
Nobutaka Oi;Satoshi Okubo;Ikuto Tsuyuzaki;Atsushi Hiraiwa;Hiroshi Kawarada
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Abstract

Diamond is a promising material for p-channel power field-effect transistors (FETs) due to its remarkable physical properties. However, no diamond FETs with current characteristics exceeding 1 A have so far been reported. P-channel FETs capable of high-current operation are essential in order to realize complementary inverters with n-channel wide bandgap devices such as SiC or GaN. In this work, we designed and fabricated vertical-type diamond metal-oxide-semiconductor FETs (MOSFETs) with a trench structure, and a gate width ( ${W} _{\text {G}}\text {)}$ of 0.1 to 10 mm. For devices with ${W} _{\text {G}} =10$ mm and a source-drain voltage ( ${V} _{\text {DS}}\text {)}$ of –20 V, the drain current reached 0.7 A. We obtained a maximum drain current of over 1.5 A with ${V} _{\text {DS}} =$ –20 V by connecting two devices in parallel within a chip. The drain current density and specific on-resistance at a ${V} _{\text {DS}}$ of –10 V were 85 mA/mm and $118~\Omega \cdot $ mm, respectively ( ${W} _{\text {G}} =2$ mm). The leakage current in the off state is at the lower limit of the measurement ( $\sim 10^{-{11}}$ A) and the on/off ratio is over nine orders of magnitude.
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垂直型金刚石 MOSFET 超过 1 A 的工作电流
金刚石具有显著的物理特性,是一种很有前途的 p 沟道功率场效应晶体管(FET)材料。然而,迄今为止还没有报道过电流特性超过 1 A 的金刚石场效应晶体管。要实现与碳化硅或氮化镓等 n 沟道宽带隙器件的互补逆变器,必须要有能够大电流工作的 P 沟道场效应晶体管。在这项工作中,我们设计并制造了具有沟槽结构的垂直型金刚石金属氧化物半导体场效应晶体管(MOSFET),栅极宽度(${W} _\text {G}\text {)}$为 0.1 至 10 毫米。对于 ${W}${W} _{text {G}} =10$ mm、源极-漏极电压 ( ${V} _{text {DS}}\text {)}$ 为 -20 V 时,漏极电流达到 0.7 A。_{\text {DS}} =$ -20 V 时,我们获得了超过 1.5 A 的最大漏极电流。在 ${V} _{\text {DS}} 时的漏极电流密度和比导通电阻为${V} _{\text {DS}}$ 为 -10 V 时的漏极电流密度和比导通电阻分别为 85 mA/mm 和 $118~\Omega \cdot $ mm(${W} _{\text {G}} =2$ mm)。关断状态下的泄漏电流处于测量值的下限($\sim 10^{-{11}}$ A),导通/关断比超过九个数量级。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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Table of Contents Front Cover IEEE Electron Device Letters Publication Information IEEE Electron Device Letters Information for Authors Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices
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