{"title":"Over 1 A Operation of Vertical-Type Diamond MOSFETs","authors":"Nobutaka Oi;Satoshi Okubo;Ikuto Tsuyuzaki;Atsushi Hiraiwa;Hiroshi Kawarada","doi":"10.1109/LED.2024.3427423","DOIUrl":null,"url":null,"abstract":"Diamond is a promising material for p-channel power field-effect transistors (FETs) due to its remarkable physical properties. However, no diamond FETs with current characteristics exceeding 1 A have so far been reported. P-channel FETs capable of high-current operation are essential in order to realize complementary inverters with n-channel wide bandgap devices such as SiC or GaN. In this work, we designed and fabricated vertical-type diamond metal-oxide-semiconductor FETs (MOSFETs) with a trench structure, and a gate width (\n<inline-formula> <tex-math>${W} _{\\text {G}}\\text {)}$ </tex-math></inline-formula>\n of 0.1 to 10 mm. For devices with \n<inline-formula> <tex-math>${W} _{\\text {G}} =10$ </tex-math></inline-formula>\n mm and a source-drain voltage (\n<inline-formula> <tex-math>${V} _{\\text {DS}}\\text {)}$ </tex-math></inline-formula>\n of –20 V, the drain current reached 0.7 A. We obtained a maximum drain current of over 1.5 A with \n<inline-formula> <tex-math>${V} _{\\text {DS}} =$ </tex-math></inline-formula>\n –20 V by connecting two devices in parallel within a chip. The drain current density and specific on-resistance at a \n<inline-formula> <tex-math>${V} _{\\text {DS}}$ </tex-math></inline-formula>\n of –10 V were 85 mA/mm and \n<inline-formula> <tex-math>$118~\\Omega \\cdot $ </tex-math></inline-formula>\nmm, respectively (\n<inline-formula> <tex-math>${W} _{\\text {G}} =2$ </tex-math></inline-formula>\n mm). The leakage current in the off state is at the lower limit of the measurement (\n<inline-formula> <tex-math>$\\sim 10^{-{11}}$ </tex-math></inline-formula>\nA) and the on/off ratio is over nine orders of magnitude.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":null,"pages":null},"PeriodicalIF":4.1000,"publicationDate":"2024-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10630699","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10630699/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Diamond is a promising material for p-channel power field-effect transistors (FETs) due to its remarkable physical properties. However, no diamond FETs with current characteristics exceeding 1 A have so far been reported. P-channel FETs capable of high-current operation are essential in order to realize complementary inverters with n-channel wide bandgap devices such as SiC or GaN. In this work, we designed and fabricated vertical-type diamond metal-oxide-semiconductor FETs (MOSFETs) with a trench structure, and a gate width (
${W} _{\text {G}}\text {)}$
of 0.1 to 10 mm. For devices with
${W} _{\text {G}} =10$
mm and a source-drain voltage (
${V} _{\text {DS}}\text {)}$
of –20 V, the drain current reached 0.7 A. We obtained a maximum drain current of over 1.5 A with
${V} _{\text {DS}} =$
–20 V by connecting two devices in parallel within a chip. The drain current density and specific on-resistance at a
${V} _{\text {DS}}$
of –10 V were 85 mA/mm and
$118~\Omega \cdot $
mm, respectively (
${W} _{\text {G}} =2$
mm). The leakage current in the off state is at the lower limit of the measurement (
$\sim 10^{-{11}}$
A) and the on/off ratio is over nine orders of magnitude.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.