Theoretical Power Figure-of-Merit in β -Ga2O3 Lateral Power Transistors Determined Using Physics-Based TCAD Simulation

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-08-07 DOI:10.1109/TED.2024.3436711
Shaikh S. Ahmed;Ahmad E. Islam;Daniel M. Dryden;Kyle J. Liddy;Nolan S. Hendricks;Neil A. Moser;Kelson D. Chabak;Andrew J. Green
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Abstract

We calculated power figure-of-merit (PFoM) in $\beta $ -Ga2O3-based lateral metal-semiconductor field-effect transistors (MESFETs) by simulating the current-voltage (I–V) and breakdown characteristics. Simulation results were benchmarked with the characteristics measured on similar devices. For theoretical analysis, we used atomistic analysis of carrier mobility, self-consistent simulation of electrostatics and carrier transport, and a refined impact ionization model. Our analysis revealed the importance of considering off-state leakage mechanism, 2-D electrostatics, and current conduction pathways for majority and (generated) minority carriers for avalanche breakdown simulation in $\beta $ -Ga2O3 lateral MESFETs. This is a significant advancement over the electric field-based approach that is used in literature for breakdown studies. This study also highlights the importance of considering extrinsic breakdown pathways that often limit the observation of avalanche breakdown in these devices.
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利用基于物理的 TCAD 仿真确定的 $beta $-Ga$_{\text{2}}$O$_{\text{3}}$ 侧向功率晶体管的理论功率特性图
我们通过模拟电流-电压(I-V)和击穿特性,计算了基于 $\beta $ -Ga2O3 的横向金属半导体场效应晶体管(MESFET)的功率因数(PFoM)。模拟结果与在类似器件上测量的特性进行了比对。在理论分析方面,我们采用了载流子迁移率的原子分析、静电和载流子传输的自洽模拟以及精炼的撞击电离模型。我们的分析表明,在$\beta $ -Ga2O3 横向 MESFET 的雪崩击穿模拟中,考虑离态泄漏机制、二维静电以及多数和(产生的)少数载流子的电流传导路径非常重要。与文献中用于击穿研究的基于电场的方法相比,这是一个重大进步。这项研究还强调了考虑外在击穿途径的重要性,因为外在击穿途径往往会限制对这些器件雪崩击穿的观察。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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