Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach

Abstract

Thermoset resins are singular materials in the field of microelectronics. Because they exhibit a high contrast of thermomechanical properties with other integrated materials like oxides, metals or silicon, polymers can threaten the mechanical integrity of stacks. Knowing polymer properties allows manufacturers to foresee the compatibility between materials and improve chipsets reliability. At a bilayer scale, the properties mismatch between the polymer film and the silicon substrate causes an overall curvature of the wafer which evolves with temperature. By comparing the thermally induced curvature of two distinct substrates with the same film, the biaxial modulus and the coefficient of thermal expansion of the film can be determined. This method can not only check the achievement of the polymer cross-linking, but also estimates their relaxation temperatures. In this article, we present the ability of this method to, not only, measure those properties in the glassy state, but also, for the first time, in the rubbery state. We also illustrate the proficiency of this approach in detecting and characterizing two successive glassy states.