A Distributed Theory for Contactless Interconnects at Terahertz Frequencies

Abstract

We test a multimodal analytical model for distributed contactless interconnects by comparing it to 3-D full-wave simulations. In comparison to 3-D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating and optimizing the interconnect’s performance. The model predicts the performance of four distributed contactless interconnects and finds good agreement between with 3-D simulations up to 1 THz. All the interconnects have less than 1-dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.