Controllable diamond cutting of structured surfaces with subnanometric height features on silicon

Zhongwei Li, Yuan-Liu Chen
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Abstract

Diamond cutting with a controllable depth of cut at the subnanometric scale is desired for next-generation electronics and optics. However, due to the limits of positioning accuracy of the current machine tools, diamond cutting at subnanometric scale depths remains in realm of molecular dynamic (MD) simulations instead of engineering realization. Cutting force feedback and control is regarded as a potential method to improve the positioning accuracy of machine tools. In this study, an ultra-precision force feedback loop with the resolution down to submillinewton is employed and integrated on an ultra-precision machine tool to enable the capability of cutting at subnanometric scale depth. By this way, the relationship between the cutting force and such small depth of cut needs to be well studied. MD simulations are conducted in this study to analyze the mechanism of material removal and influence of the crystallographic effect on the actual cutting depth and force caused by varied cutting directions at subnanometric to nanometric scale depth in diamond turning. Then, the crystallographic effect of silicon with the depth of cut from subnanometric to nanometric scale is compensated experimentally for accurate cutting at such an extremely small scale. Controllable diamond cutting of structured surfaces with actual depths and amplitudes ranging from several angstroms to a few nanometers on silicon is successfully realized.

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可控金刚石切割具有亚纳米高度特征的硅结构表面
下一代电子和光学领域需要可控亚纳米级切割深度的金刚石。然而,由于现有机床定位精度的限制,亚纳米尺度深度的金刚石切割仍停留在分子动力学(MD)模拟领域,而非工程实现。切削力反馈和控制被认为是提高机床定位精度的潜在方法。在本研究中,我们采用了分辨率低至亚牛顿的超精密力反馈回路,并将其集成到超精密机床上,以实现亚纳米级深度的切削能力。因此,需要对切削力与如此小的切削深度之间的关系进行深入研究。本研究通过 MD 模拟,分析了金刚石车削在亚纳米级到纳米级深度下的材料去除机理以及晶体学效应对不同切削方向造成的实际切削深度和切削力的影响。然后,通过实验补偿了硅的晶体学效应对亚纳米级到纳米级切割深度的影响,从而在如此微小的尺度上实现精确切割。成功实现了对硅结构表面的可控金刚石切割,实际深度和振幅从几个埃到几个纳米不等。
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来源期刊
CiteScore
7.40
自引率
5.60%
发文量
177
审稿时长
46 days
期刊介绍: Precision Engineering - Journal of the International Societies for Precision Engineering and Nanotechnology is devoted to the multidisciplinary study and practice of high accuracy engineering, metrology, and manufacturing. The journal takes an integrated approach to all subjects related to research, design, manufacture, performance validation, and application of high precision machines, instruments, and components, including fundamental and applied research and development in manufacturing processes, fabrication technology, and advanced measurement science. The scope includes precision-engineered systems and supporting metrology over the full range of length scales, from atom-based nanotechnology and advanced lithographic technology to large-scale systems, including optical and radio telescopes and macrometrology.
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