{"title":"Competition between microstructural factors affecting growth of abnormally large grains in thin Cu foils","authors":"","doi":"10.1016/j.actamat.2024.120339","DOIUrl":null,"url":null,"abstract":"<div><p>Grain boundary types and local boundary curvatures are generally considered to be important microstructural factors controlling grain boundary migration during grain growth. In this work, grain growth in thin copper foils is studied during annealing at a temperature of 1040 °C near the melting point by ex-situ experiments and Monte Carlo simulations. Few grains, stimulated by slight deformation at the sample edge, are observed to grow abnormally into the cube-oriented recrystallized microstructure with columnar grains spanning the foil thickness. The grain boundaries of these abnormally growing grains and the grain sizes in the adjacent polycrystalline recrystallized regions are analyzed. The experimental results suggest that spatial heterogeneities in the distribution of small recrystallized grains have a significant effect on the migrating boundaries. Potts model simulations confirm that grain boundary segments with small grains in front are more likely to migrate than segments facing coarser grains. The simulations also demonstrate the importance of grain morphology. Altogether, this work highlights the effects of a heterogeneous recrystallized microstructure on abnormal grain growth in thin foil samples.</p></div>","PeriodicalId":238,"journal":{"name":"Acta Materialia","volume":null,"pages":null},"PeriodicalIF":8.3000,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Materialia","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S135964542400689X","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Grain boundary types and local boundary curvatures are generally considered to be important microstructural factors controlling grain boundary migration during grain growth. In this work, grain growth in thin copper foils is studied during annealing at a temperature of 1040 °C near the melting point by ex-situ experiments and Monte Carlo simulations. Few grains, stimulated by slight deformation at the sample edge, are observed to grow abnormally into the cube-oriented recrystallized microstructure with columnar grains spanning the foil thickness. The grain boundaries of these abnormally growing grains and the grain sizes in the adjacent polycrystalline recrystallized regions are analyzed. The experimental results suggest that spatial heterogeneities in the distribution of small recrystallized grains have a significant effect on the migrating boundaries. Potts model simulations confirm that grain boundary segments with small grains in front are more likely to migrate than segments facing coarser grains. The simulations also demonstrate the importance of grain morphology. Altogether, this work highlights the effects of a heterogeneous recrystallized microstructure on abnormal grain growth in thin foil samples.
一般认为,晶界类型和局部晶界曲率是控制晶粒生长过程中晶界迁移的重要微观结构因素。本研究通过原位实验和蒙特卡罗模拟,研究了薄铜箔在接近熔点的 1040 °C 退火过程中的晶粒生长。在样品边缘轻微变形的刺激下,观察到少数晶粒异常生长成立方体取向的再结晶微结构,柱状晶粒遍布整个铜箔厚度。对这些异常生长晶粒的晶界以及相邻多晶再结晶区域的晶粒尺寸进行了分析。实验结果表明,小再结晶晶粒分布的空间异质性对迁移边界有显著影响。波特斯模型模拟证实,前面有小颗粒的晶界段比面对较粗颗粒的晶界段更容易迁移。模拟还证明了晶粒形态的重要性。总之,这项工作强调了异质再结晶微结构对薄箔样品中异常晶粒生长的影响。
期刊介绍:
Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.