Revealing the nanoscale reinforcing mechanism: How topological structure of carbon black clusters influence the mechanics of rubber

IF 8.3 1区 材料科学 Q1 MATERIALS SCIENCE, COMPOSITES Composites Science and Technology Pub Date : 2024-09-05 DOI:10.1016/j.compscitech.2024.110847
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Abstract

The mechanical reinforcement of rubber by carbon black (CB) depends strongly on its the size and topography of CB clusters. However, the underlying mechanisms remain largely unexplored. This study uses atomic force microscopy (AFM) to probe interfacial properties at the nanoscale to elucidate the influence of the CB topological structure on macroscopic mechanical properties. A substantial amount of high-modulus bound rubber is found inside the CB aggregates, particularly in highly branched ones. This phenomenon plays a critical role in reinforcement, as corroborated by quantitative AFM nanomechanics, chain segment motion results and theoretical calculations. A quantitative analysis of the filler network reveals that the branched chain structure effectively reduces the packing spacing and improves the stress transfer efficiency.

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揭示纳米级补强机制:炭黑团簇的拓扑结构如何影响橡胶的力学性能
炭黑(CB)对橡胶的机械补强作用在很大程度上取决于炭黑团块的大小和形貌。然而,其基本机制在很大程度上仍未得到探索。本研究使用原子力显微镜(AFM)探测纳米尺度的界面特性,以阐明炭黑拓扑结构对宏观机械特性的影响。在 CB 聚合体内部发现了大量的高模量结合橡胶,尤其是在高度支化的 CB 聚合体中。原子力显微镜纳米力学定量分析、链段运动结果和理论计算都证实了这一现象在补强中的关键作用。对填料网络的定量分析显示,支链结构有效地减小了堆积间距,提高了应力传递效率。
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来源期刊
Composites Science and Technology
Composites Science and Technology 工程技术-材料科学:复合
CiteScore
16.20
自引率
9.90%
发文量
611
审稿时长
33 days
期刊介绍: Composites Science and Technology publishes refereed original articles on the fundamental and applied science of engineering composites. The focus of this journal is on polymeric matrix composites with reinforcements/fillers ranging from nano- to macro-scale. CSTE encourages manuscripts reporting unique, innovative contributions to the physics, chemistry, materials science and applied mechanics aspects of advanced composites. Besides traditional fiber reinforced composites, novel composites with significant potential for engineering applications are encouraged.
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