{"title":"Calculation of Cable SGEMP Response for PCB Trace Based on Finite Element Method","authors":"Maoxing Zhang;Cui Meng;Yinong Liu","doi":"10.1109/TNS.2024.3439609","DOIUrl":null,"url":null,"abstract":"When a printed circuit board (PCB) is irradiated by transient X-ray, photoelectrons will be emitted due to the photoelectric effect, resulting in coupling current response on the metal trace, which may interfere with or damage the components connected to the trace. This article derives the transmission line equation of PCB trace under X-ray irradiation and establishes a simulation code based on the finite element method (FEM), which can more accurately express the distribution of deposited charges in the substrate, making the simulation results more accurate. The effects of some parameters (such as trace width, substrate thickness, and bias voltage) on the coupling response were simulated and analyzed.","PeriodicalId":13406,"journal":{"name":"IEEE Transactions on Nuclear Science","volume":"71 11","pages":"2361-2376"},"PeriodicalIF":1.9000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Nuclear Science","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10636034/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
When a printed circuit board (PCB) is irradiated by transient X-ray, photoelectrons will be emitted due to the photoelectric effect, resulting in coupling current response on the metal trace, which may interfere with or damage the components connected to the trace. This article derives the transmission line equation of PCB trace under X-ray irradiation and establishes a simulation code based on the finite element method (FEM), which can more accurately express the distribution of deposited charges in the substrate, making the simulation results more accurate. The effects of some parameters (such as trace width, substrate thickness, and bias voltage) on the coupling response were simulated and analyzed.
当印刷电路板（PCB）受到瞬态 X 射线照射时，由于光电效应会发射出光电子，从而在金属迹线上产生耦合电流响应，这可能会干扰或损坏与迹线相连的元件。本文推导了 X 射线辐照下 PCB 金属迹线的传输线方程，并建立了基于有限元法（FEM）的仿真代码，可以更准确地表达沉积电荷在基板中的分布，使仿真结果更加精确。模拟和分析了一些参数（如线路宽度、基板厚度和偏置电压）对耦合响应的影响。
期刊介绍：
The IEEE Transactions on Nuclear Science is a publication of the IEEE Nuclear and Plasma Sciences Society. It is viewed as the primary source of technical information in many of the areas it covers. As judged by JCR impact factor, TNS consistently ranks in the top five journals in the category of Nuclear Science & Technology. It has one of the higher immediacy indices, indicating that the information it publishes is viewed as timely, and has a relatively long citation half-life, indicating that the published information also is viewed as valuable for a number of years.
The IEEE Transactions on Nuclear Science is published bimonthly. Its scope includes all aspects of the theory and application of nuclear science and engineering. It focuses on instrumentation for the detection and measurement of ionizing radiation; particle accelerators and their controls; nuclear medicine and its application; effects of radiation on materials, components, and systems; reactor instrumentation and controls; and measurement of radiation in space.
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