A novel high entropy composite interlayer for diffusion bonding of TC4 titanium alloy to 316L stainless steel

IF 3.7 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Today Communications Pub Date : 2024-09-02 DOI:10.1016/j.mtcomm.2024.110291

Yinchen Wang, Peng Li, Chenhao Zhao, Zhijie Ding, Chao Li, Yue Yao, Honggang Dong

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Abstract

Titanium/steel hybrid structure exhibit broad prospects in the nuclear industry and aerospace applications. Achieving high-performance titanium/steel bonding is crucial. Herein, the novel AlCoCrNiCuAg/Cu high entropy composite interlayer was designed for vacuum diffusion bonding of TC4 alloy to 316L stainless steel. The effects of bonding temperature, holding time and assembly sequence on the interfacial microstructure and mechanical properties were investigated, and the fracture behaviors were researched. Typical microstructure of the joint bonded at 1010 °C for 90 min via AlCoCrNiCuAg/Cu sequence was TC4/β-Ti/β-Ti+TiFe/TiFe+χ+σ/α-Fe+χ+σ/316L. With bonding temperature increased, due to the dispersed distribution of the Cu phase in the Ti-Fe phases, the highest shear strength of 222.8 MPa was achieved at 1010 °C/90 min. The cleavage characteristics were confirmed in the fracture surfaces, suggesting the brittle fracture. The main cracks were located at the junction of the TiFe+χ+σ and the β-Ti+TiFe layers, further confirmed that the interface appeared immense strain, accelerating the joint fracture.

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用于 TC4 钛合金与 316L 不锈钢扩散粘接的新型高熵复合中间膜

钛/钢混合结构在核工业和航空航天领域有着广阔的应用前景。实现高性能的钛/钢结合至关重要。本文设计了新型 AlCoCrNiCuAg/Cu 高熵复合中间膜，用于 TC4 合金与 316L 不锈钢的真空扩散键合。研究了接合温度、保温时间和装配顺序对界面微观结构和力学性能的影响，并对断裂行为进行了研究。通过 AlCoCrNiCuAg/Cu 序列在 1010 °C 下粘合 90 分钟的接头的典型微观结构为 TC4/β-Ti/β-Ti+TiFe/TiFe+χ+σ/α-Fe+χ+σ/316L。随着结合温度的升高，由于铜相在 Ti-Fe 相中的分散分布，在 1010 °C/90 分钟时达到了 222.8 MPa 的最高剪切强度。断裂表面的劈裂特征得到证实，表明是脆性断裂。主要裂纹位于 TiFe+χ+σ 和 β-Ti+TiFe 层的交界处，进一步证实了界面出现了巨大应变，加速了连接断裂。

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来源期刊

Materials Today Communications Materials Science-General Materials Science

CiteScore

5.20

自引率

5.30%

发文量

1783

审稿时长

51 days

期刊介绍： Materials Today Communications is a primary research journal covering all areas of materials science. The journal offers the materials community an innovative, efficient and flexible route for the publication of original research which has not found the right home on first submission.