{"title":"A Single-Stage Gain-Boosted Cascode Amplifier With Three-Layer Cascode Feedback Amplifier for Front-End SHA in High-Linearity Pipelined ADC","authors":"Yu Liu;Yupeng Shen;Mingliang Chen;Hui Xu;Xubin Chen;Jiarui Liu;Zhiyu Wang;Faxin Yu","doi":"10.1109/TVLSI.2024.3439374","DOIUrl":null,"url":null,"abstract":"In this brief, a high-gain and wide-bandwidth single-stage gain-boosted cascode amplifier (GBCA) is proposed for the front-end sample-and-hold amplifier (SHA) in 14-bit 2.5-GS/s pipelined analog-to-digital converter (ADC). This GBCA is composed of a two-layer main cascode amplifier and a three-layer cascode feedback amplifier (FA). The three-layer cascode structure introduces more than 20-dB gain enhancement compared with conventional two-layer FAs. However, adjacent poles appear near the gain bandwidth product (GBW) of the three-layer cascode FA, which may seriously deteriorate the phase margin (PM) of the FA and further prolong the settling time of closed-loop GBCA. A PM expansion technique is proposed to improve the PM of FA by adding a group of switched capacitor array. At the same time, the open-loop GBCA achieves 104-dB direct-current (dc) gain and 65.2-GHz GBW, which satisfies the harsh requirements of the ping-pong interleaved SHA with 12-dB gain on-chip. The pipelined ADC fabricated in 28-nm CMOS process consumes 554 mW at 2.5-GS/s sampling rate, while achieves a signal-to-noise-and-distortion ratio (SNDR) of 52.5 dB and a spurious free dynamic range (SFDR) of 86.4 dBc with 161-MHz input signal.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 1","pages":"47-51"},"PeriodicalIF":2.8000,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10638486/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
In this brief, a high-gain and wide-bandwidth single-stage gain-boosted cascode amplifier (GBCA) is proposed for the front-end sample-and-hold amplifier (SHA) in 14-bit 2.5-GS/s pipelined analog-to-digital converter (ADC). This GBCA is composed of a two-layer main cascode amplifier and a three-layer cascode feedback amplifier (FA). The three-layer cascode structure introduces more than 20-dB gain enhancement compared with conventional two-layer FAs. However, adjacent poles appear near the gain bandwidth product (GBW) of the three-layer cascode FA, which may seriously deteriorate the phase margin (PM) of the FA and further prolong the settling time of closed-loop GBCA. A PM expansion technique is proposed to improve the PM of FA by adding a group of switched capacitor array. At the same time, the open-loop GBCA achieves 104-dB direct-current (dc) gain and 65.2-GHz GBW, which satisfies the harsh requirements of the ping-pong interleaved SHA with 12-dB gain on-chip. The pipelined ADC fabricated in 28-nm CMOS process consumes 554 mW at 2.5-GS/s sampling rate, while achieves a signal-to-noise-and-distortion ratio (SNDR) of 52.5 dB and a spurious free dynamic range (SFDR) of 86.4 dBc with 161-MHz input signal.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.