Pub Date : 2024-10-25DOI: 10.1109/TVLSI.2024.3474954
{"title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems Society Information","authors":"","doi":"10.1109/TVLSI.2024.3474954","DOIUrl":"https://doi.org/10.1109/TVLSI.2024.3474954","url":null,"abstract":"","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 11","pages":"C3-C3"},"PeriodicalIF":2.8,"publicationDate":"2024-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10736407","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142517964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-25DOI: 10.1109/TVLSI.2024.3474952
{"title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems Publication Information","authors":"","doi":"10.1109/TVLSI.2024.3474952","DOIUrl":"https://doi.org/10.1109/TVLSI.2024.3474952","url":null,"abstract":"","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 11","pages":"C2-C2"},"PeriodicalIF":2.8,"publicationDate":"2024-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10736448","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142518187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-26DOI: 10.1109/TVLSI.2024.3457191
{"title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems Publication Information","authors":"","doi":"10.1109/TVLSI.2024.3457191","DOIUrl":"https://doi.org/10.1109/TVLSI.2024.3457191","url":null,"abstract":"","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 10","pages":"C2-C2"},"PeriodicalIF":2.8,"publicationDate":"2024-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10695157","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142324285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-26DOI: 10.1109/TVLSI.2024.3457193
{"title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems Society Information","authors":"","doi":"10.1109/TVLSI.2024.3457193","DOIUrl":"https://doi.org/10.1109/TVLSI.2024.3457193","url":null,"abstract":"","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 10","pages":"C3-C3"},"PeriodicalIF":2.8,"publicationDate":"2024-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10695474","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142324368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
High-resolution successive approximation register (SAR) analog-to-digital converters (ADCs) commonly need to calibrate their bit weights. Due to the nonidealities of the calibration circuits, the calibrated bit weights carry errors. This error could propagate during the calibration procedure. Due to the high precision requirement of these ADCs, such residue error commonly becomes the signal-to-noise-and-distortion ratio (SNDR) bottleneck of the overall ADC. This article presents an analysis of the residue error from bit weight self-calibration methods of high-resolution SAR ADCs. The major sources contributing to this error and the error reduction methods are quantitively analyzed. A statistical analysis of the noise-induced random error is developed. Our statistical model finds that the noise-induced random error follows the chi-square distribution. In practice, this random error is commonly reduced by repetitively measuring and averaging the calibrated bit weights. Our statistical model quantifies this bit weight error and leads to a clearer understanding of the error mechanism and design trade-offs. Following our chi-square model, the SNDR degradation due to the circuit noise during the calibration can be easily estimated without going through the time-consuming traditional transistor-level design and simulation process. The required repetition time can also be calculated. The bit-weight error models derived in this article are verified with measurement on a 16-bit SAR ADC design in a 180-nm CMOS process. Results from our model match both simulations and measurements well.
高分辨率逐次逼近寄存器（SAR）模数转换器（ADC）通常需要校准位权重。由于校准电路的非理想性，校准后的位权重会产生误差。这种误差可能在校准过程中传播。由于这些 ADC 的精度要求很高，这种残余误差通常会成为整个 ADC 的信噪比 (SNDR) 瓶颈。本文分析了高分辨率 SAR ADC 位权自校准方法产生的残差误差。文章定量分析了造成这一误差的主要来源和减少误差的方法。文章对噪声引起的随机误差进行了统计分析。我们的统计模型发现，噪声引起的随机误差遵循秩方分布。在实践中，这种随机误差通常通过重复测量和平均校准位权来减少。我们的统计模型量化了这种位权重误差，使人们对误差机制和设计权衡有了更清晰的认识。根据我们的秩方模型，校准过程中电路噪声导致的 SNDR 下降可以很容易地估算出来，而无需进行耗时的传统晶体管级设计和仿真过程。所需的重复时间也可以计算出来。本文推导出的位重误差模型在 180-nm CMOS 工艺的 16 位 SAR ADC 设计上进行了测量验证。我们的模型得出的结果与模拟和测量结果十分吻合。
{"title":"The Error Analysis of Bit Weight Self-Calibration Methods for High-Resolution SAR ADCs","authors":"Yanhang Chen;Siji Huang;Qifeng Huang;Yifei Fan;Jie Yuan","doi":"10.1109/TVLSI.2024.3458071","DOIUrl":"https://doi.org/10.1109/TVLSI.2024.3458071","url":null,"abstract":"High-resolution successive approximation register (SAR) analog-to-digital converters (ADCs) commonly need to calibrate their bit weights. Due to the nonidealities of the calibration circuits, the calibrated bit weights carry errors. This error could propagate during the calibration procedure. Due to the high precision requirement of these ADCs, such residue error commonly becomes the signal-to-noise-and-distortion ratio (SNDR) bottleneck of the overall ADC. This article presents an analysis of the residue error from bit weight self-calibration methods of high-resolution SAR ADCs. The major sources contributing to this error and the error reduction methods are quantitively analyzed. A statistical analysis of the noise-induced random error is developed. Our statistical model finds that the noise-induced random error follows the chi-square distribution. In practice, this random error is commonly reduced by repetitively measuring and averaging the calibrated bit weights. Our statistical model quantifies this bit weight error and leads to a clearer understanding of the error mechanism and design trade-offs. Following our chi-square model, the SNDR degradation due to the circuit noise during the calibration can be easily estimated without going through the time-consuming traditional transistor-level design and simulation process. The required repetition time can also be calculated. The bit-weight error models derived in this article are verified with measurement on a 16-bit SAR ADC design in a 180-nm CMOS process. Results from our model match both simulations and measurements well.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 11","pages":"1983-1992"},"PeriodicalIF":2.8,"publicationDate":"2024-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142518122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-18DOI: 10.1109/TVLSI.2024.3439231
Duy-Thanh Nguyen;Abhiroop Bhattacharjee;Abhishek Moitra;Priyadarshini Panda
AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies, such as nonvolatile memory, which offers fast read memory access and a small cell area. Despite these advantages, nonvolatile memory’s slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated embedded dynamic random access memory (eDRAM) as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off among performance, area, and power consumption unresolved. To address this issue, this article presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. In addition, we capitalize on the characteristics of deep neural network (DNN) data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that the MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48% and energy consumption by $3.4times $ compared with SRAM designs, without incurring any accuracy loss.
{"title":"MCAIMem: A Mixed SRAM and eDRAM Cell for Area and Energy-Efficient On-Chip AI Memory","authors":"Duy-Thanh Nguyen;Abhiroop Bhattacharjee;Abhishek Moitra;Priyadarshini Panda","doi":"10.1109/TVLSI.2024.3439231","DOIUrl":"10.1109/TVLSI.2024.3439231","url":null,"abstract":"AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies, such as nonvolatile memory, which offers fast read memory access and a small cell area. Despite these advantages, nonvolatile memory’s slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated embedded dynamic random access memory (eDRAM) as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off among performance, area, and power consumption unresolved. To address this issue, this article presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. In addition, we capitalize on the characteristics of deep neural network (DNN) data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that the MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48% and energy consumption by \u0000<inline-formula> <tex-math>$3.4times $ </tex-math></inline-formula>\u0000 compared with SRAM designs, without incurring any accuracy loss.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 11","pages":"2023-2036"},"PeriodicalIF":2.8,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142266248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-18DOI: 10.1109/tvlsi.2024.3453897
Zilin Wang, Yi Zhong, Zehong Ou, Youming Yang, Shuo Feng, Guang Chen, Xiaoxin Cui, Song Jia, Yuan Wang
{"title":"Marmotini: A Weight Density Adaptation Architecture With Hybrid Compression Method for Spiking Neural Network","authors":"Zilin Wang, Yi Zhong, Zehong Ou, Youming Yang, Shuo Feng, Guang Chen, Xiaoxin Cui, Song Jia, Yuan Wang","doi":"10.1109/tvlsi.2024.3453897","DOIUrl":"https://doi.org/10.1109/tvlsi.2024.3453897","url":null,"abstract":"","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"28 1","pages":""},"PeriodicalIF":2.8,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142266250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：