Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, and Quantum Computing Systems—Overview, Challenges, and Opportunities

IF 3.7 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2024-08-19 DOI:10.1109/JETCAS.2024.3445829
Abhijit Das;Maurizio Palesi;John Kim;Partha Pratim Pande
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Abstract

The anticipated end of Moore’s law, coupled with the breakdown of Dennard scaling, compelled everyone to conceive forthcoming computing systems once transistors reach their limits. Three leading approaches to circumvent this situation are the chiplet paradigm, domain customisation and quantum computing. However, architectural and technological innovations have shifted the fundamental bottleneck from computation to communication. Hence, on-chip and on-package communication play a pivotal role in determining the performance, energy efficiency and scalability of general-purpose, domain-specific and quantum computing systems. This article reviews the recent advances in chip and package-scale interconnects due to the change in architecture, application and technology. The primary objective of this article is to present the current status, key challenges, and impact-worthy opportunities in this research area from the perspective of hardware architectures. The secondary objective of this article is to serve as a tutorial providing an overview of academic and industrial explorations in chip and package-scale communication infrastructure design for general-purpose, domain-specific and quantum computing systems.
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通用、特定领域和量子计算系统的芯片和封装级互连 - 概述、挑战和机遇
摩尔定律的预期终结,再加上邓纳缩放的崩溃,迫使每个人都在构想晶体管达到极限后即将出现的计算系统。规避这种情况的三种主要方法是芯片范式、领域定制和量子计算。然而,架构和技术创新已将根本瓶颈从计算转移到通信。因此,片上和封装上通信在决定通用、特定领域和量子计算系统的性能、能效和可扩展性方面发挥着举足轻重的作用。本文回顾了由于架构、应用和技术的变化而导致的芯片级和封装级互连的最新进展。本文的主要目的是从硬件架构的角度介绍这一研究领域的现状、关键挑战和有影响的机遇。本文的次要目的是作为教程,概述学术界和工业界在通用、特定领域和量子计算系统的芯片和封装级通信基础设施设计方面的探索。
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CiteScore
8.50
自引率
2.20%
发文量
86
期刊介绍: The IEEE Journal on Emerging and Selected Topics in Circuits and Systems is published quarterly and solicits, with particular emphasis on emerging areas, special issues on topics that cover the entire scope of the IEEE Circuits and Systems (CAS) Society, namely the theory, analysis, design, tools, and implementation of circuits and systems, spanning their theoretical foundations, applications, and architectures for signal and information processing.
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Introducing IEEE Collabratec Table of Contents IEEE Journal on Emerging and Selected Topics in Circuits and Systems Information for Authors IEEE Circuits and Systems Society Information IEEE Journal on Emerging and Selected Topics in Circuits and Systems Publication Information
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