Bekari Gabritchidze;Justin H. Chen;Kieran A. Cleary;Anthony C. Readhead;Austin J. Minnich
{"title":"Experimental Investigation of Drain Noise in High Electron Mobility Transistors: Thermal and Hot Electron Noise","authors":"Bekari Gabritchidze;Justin H. Chen;Kieran A. Cleary;Anthony C. Readhead;Austin J. Minnich","doi":"10.1109/TED.2024.3445889","DOIUrl":null,"url":null,"abstract":"We report the on-wafer characterization of \n<italic>S</i>\n-parameters and microwave noise temperature (\n<inline-formula> <tex-math>${T}_{{50}}$ </tex-math></inline-formula>\n) of discrete metamorphic InGaAs high electron mobility transistors (mHEMTs) at 40 and 300 K and over a range of drain-source voltages (\n<inline-formula> <tex-math>${V}_{\\text {DS}}$ </tex-math></inline-formula>\n). From these data, we extract a small-signal model (SSM) and the drain (output) noise current power spectral density (\n<inline-formula> <tex-math>${S}_{{id}}$ </tex-math></inline-formula>\n) at each bias and temperature. This procedure enables \n<inline-formula> <tex-math>${S}_{{id}}$ </tex-math></inline-formula>\n to be obtained while accounting for the variation of SSM, noise impedance match, and other parameters under the various conditions. We find that the noise associated with the channel conductance can only account for a portion of the measured output noise. Considering the variation of output noise with physical temperature and bias and prior studies of microwave noise in quantum wells, we hypothesize that a hot electron noise source (NS) based on real-space transfer (RST) of electrons from the channel to the barrier could account for the remaining portion of \n<inline-formula> <tex-math>${S}_{{id}}$ </tex-math></inline-formula>\n. We suggest further studies to gain insights into the physical mechanisms. Finally, we calculate that the minimum HEMT noise temperature could be reduced by up to ~50% and ~30% at cryogenic temperature and room temperature, respectively, if the hot electron noise were suppressed.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10678926/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
We report the on-wafer characterization of
S
-parameters and microwave noise temperature (
${T}_{{50}}$
) of discrete metamorphic InGaAs high electron mobility transistors (mHEMTs) at 40 and 300 K and over a range of drain-source voltages (
${V}_{\text {DS}}$
). From these data, we extract a small-signal model (SSM) and the drain (output) noise current power spectral density (
${S}_{{id}}$
) at each bias and temperature. This procedure enables
${S}_{{id}}$
to be obtained while accounting for the variation of SSM, noise impedance match, and other parameters under the various conditions. We find that the noise associated with the channel conductance can only account for a portion of the measured output noise. Considering the variation of output noise with physical temperature and bias and prior studies of microwave noise in quantum wells, we hypothesize that a hot electron noise source (NS) based on real-space transfer (RST) of electrons from the channel to the barrier could account for the remaining portion of
${S}_{{id}}$
. We suggest further studies to gain insights into the physical mechanisms. Finally, we calculate that the minimum HEMT noise temperature could be reduced by up to ~50% and ~30% at cryogenic temperature and room temperature, respectively, if the hot electron noise were suppressed.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.