Noise Improvement and High Dynamic Range in a CMOS Image Sensor With Shift Biasing Structure

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-09-03 DOI:10.1109/TED.2024.3450650
Yang Qu;Hongwei Liang;Shanshan Lou;Guoqiang Zhong;Yu Cheng;Qian Jiang;Yuchun Chang
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Abstract

In this article, a noise improvement and dynamic range (DR) enhanced CMOS image sensor (CIS), using a shift biasing structure, is proposed. The shift biasing pixel is constructed from a conventional 4T pixel and three additional transistors, including a bias transistor (BT) and two switch transistors. The BT works as a switch to connect the source and drain to accumulate electrons in the source follower (SF) in shift biasing mode and provides an extra capacitance to enlarge the capacity of floating diffusion (FD) in low gain (LG) mode. Electron distribution and noise performance of SF are simulated to prove the function of shift biasing pixels. A prototype sensor, with a $512\times 128$ -pixel array, is fabricated with a 180 nm CIS process. Measurement shows a temporal noise of 2 e $^{-}$ is achieved, which is a 2 e $^{-}$ noise improvement compared with the reference 4T readout mode of shift biasing pixel. Additionally, an over 92 dB DR is realized by combining shift biasing mode and LG mode without any specific process or complex control circuits.
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采用移位偏置结构的 CMOS 图像传感器的噪声改善和高动态范围
本文提出了一种使用移位偏置结构的噪声改善和动态范围 (DR) 增强型 CMOS 图像传感器 (CIS)。移位偏置像素由一个传统的 4T 像素和三个附加晶体管(包括一个偏置晶体管 (BT) 和两个开关晶体管)构成。BT 在移位偏置模式下充当连接源极和漏极的开关,以便在源极跟随器(SF)中积聚电子,并在低增益(LG)模式下提供额外的电容以增大浮动扩散(FD)的容量。对 SF 的电子分布和噪声性能进行了模拟,以证明移位偏置像素的功能。传感器原型采用 180 纳米 CIS 工艺制造,像素阵列为 512×128 美元。测量结果显示,时间噪声为 2 e $^{-}$,与移位偏置像素的参考 4T 读出模式相比,噪声改善了 2 e $^{-}$。此外,通过将移位偏置模式和 LG 模式相结合,无需任何特定工艺或复杂的控制电路,就能实现超过 92 dB 的 DR。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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