A Unified Charge-Based SPICE-Compatible Flicker Noise Model for 2-D Material FETs

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-08-26 DOI:10.1109/TED.2024.3446766
Mohammad Sajid Nazir;Ateeb Naseer;Sheikh Aamir Ahsan;Yogesh Singh Chauhan
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Abstract

In this brief, we present a charge-based compact model to describe the Flicker noise or low-frequency noise (LFN) behavior in 2-D field-effect transistors (FETs). The model self-consistently incorporates mobility fluctuation and channel carrier fluctuation due to occupied trap states, in contrast to existing models that use explicit expressions. The modeling approach is simple with few fitting parameters and is validated with LFN measurements within a frequency range of 1 Hz–10 kHz. The bias dependence of the model is validated using power spectral density (PSD) measurements against multiple bias and current sweeps and implemented in Verilog-A for quick deployment in SPICE circuit simulators for 2-D material-based circuit design.
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二维材料场效应晶体管的基于电荷的 SPICE 兼容闪烁噪声统一模型
在这篇论文中,我们介绍了一种基于电荷的紧凑模型,用于描述二维场效应晶体管(FET)中的闪烁噪声或低频噪声(LFN)行为。与使用明确表达式的现有模型相比,该模型自洽地包含了迁移率波动和由于占用陷阱态引起的沟道载流子波动。建模方法简单,拟合参数少,并通过 1 Hz-10 kHz 频率范围内的 LFN 测量进行了验证。利用功率谱密度 (PSD) 测量对多个偏置和电流扫描验证了模型的偏置依赖性,并在 Verilog-A 中实施,以便在 SPICE 电路模拟器中快速部署,用于基于材料的二维电路设计。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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