Design and Optimization of Ferroelectric Spacer Engineered Modified Bi-Level Negative Capacitance FET: An Analog/RF Evaluation Perspective

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-08-26 DOI:10.1109/TDEI.2024.3449797
Santosh Kumar Padhi;Vadthiya Narendar;Atul Kumar Nishad
{"title":"Design and Optimization of Ferroelectric Spacer Engineered Modified Bi-Level Negative Capacitance FET: An Analog/RF Evaluation Perspective","authors":"Santosh Kumar Padhi;Vadthiya Narendar;Atul Kumar Nishad","doi":"10.1109/TDEI.2024.3449797","DOIUrl":null,"url":null,"abstract":"This study for the first time uses a 3 nm technology node (N3) bi-level negative capacitance FET (BLNC-FET) to examine the influence of symmetric underlap ferroelectric dual-k spacer with raised source/drain on dc and analog/RF performance. The prior dc analysis reveals the fact that BLNC-FET has an edge over the conventional and BL device. Moreover, the proposed device shows an enhancement of 7.2% in <inline-formula> <tex-math>${I}_{\\text {ON}}$ </tex-math></inline-formula> (ON current), 73.58% in <inline-formula> <tex-math>${I}_{\\text {OFF}}$ </tex-math></inline-formula> (OFF current), an excellent subthreshold slope (SS) of 57.51 mV/dec, and a Barrier rising of 52.75% in comparison to the Bi-Level FET. Therefore, the analysis for spacer variation ends up with an optimized dimension with high-k spacer length of 5 nm and low-k spacer length of 15 nm. Henceforth, continuing with BLNC-FET, this work proposes six different spacer placement configurations with symmetric underlap ferroelectric dual-k spacer along with a raised source/drain. Improved performance is acknowledged in terms of increased ON-current, reduced negative differential resistance (NDR), improved SS, improved <inline-formula> <tex-math>${I}_{\\text {ON}}$ </tex-math></inline-formula>/<inline-formula> <tex-math>${I}_{\\text {OFF}}$ </tex-math></inline-formula> ratio, and so forth. This work discovers the best results by positioning symmetric underlap dual ferroelectric dual-k spacer materials, with mitigation of NDR in DKSP1 to DKSP6. Out of all the spacer configurations, DKSP6 shows an improvement of 76.26%, 76.19%, 319%, and 317% for <inline-formula> <tex-math>${I}_{\\text {ON}}$ </tex-math></inline-formula>, SS, <inline-formula> <tex-math>${g}_{m}$ </tex-math></inline-formula> (transconductance), and transconductance generation factor (TGF), respectively, and the presence of positive DIBL and absence of NDR makes DKSP6 the better choice for BLNC-FET. It also analyzes the proposed device performance at the circuit level designing a CMOS inverter and five-stage ring oscillator followed by noise margin (NM) calculation.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 1","pages":"222-230"},"PeriodicalIF":3.1000,"publicationDate":"2024-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Dielectrics and Electrical Insulation","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10646572/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This study for the first time uses a 3 nm technology node (N3) bi-level negative capacitance FET (BLNC-FET) to examine the influence of symmetric underlap ferroelectric dual-k spacer with raised source/drain on dc and analog/RF performance. The prior dc analysis reveals the fact that BLNC-FET has an edge over the conventional and BL device. Moreover, the proposed device shows an enhancement of 7.2% in ${I}_{\text {ON}}$ (ON current), 73.58% in ${I}_{\text {OFF}}$ (OFF current), an excellent subthreshold slope (SS) of 57.51 mV/dec, and a Barrier rising of 52.75% in comparison to the Bi-Level FET. Therefore, the analysis for spacer variation ends up with an optimized dimension with high-k spacer length of 5 nm and low-k spacer length of 15 nm. Henceforth, continuing with BLNC-FET, this work proposes six different spacer placement configurations with symmetric underlap ferroelectric dual-k spacer along with a raised source/drain. Improved performance is acknowledged in terms of increased ON-current, reduced negative differential resistance (NDR), improved SS, improved ${I}_{\text {ON}}$ / ${I}_{\text {OFF}}$ ratio, and so forth. This work discovers the best results by positioning symmetric underlap dual ferroelectric dual-k spacer materials, with mitigation of NDR in DKSP1 to DKSP6. Out of all the spacer configurations, DKSP6 shows an improvement of 76.26%, 76.19%, 319%, and 317% for ${I}_{\text {ON}}$ , SS, ${g}_{m}$ (transconductance), and transconductance generation factor (TGF), respectively, and the presence of positive DIBL and absence of NDR makes DKSP6 the better choice for BLNC-FET. It also analyzes the proposed device performance at the circuit level designing a CMOS inverter and five-stage ring oscillator followed by noise margin (NM) calculation.
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铁电垫片工程改良型双电平负电容场效应晶体管的设计与优化:模拟/射频评估视角
本研究首次采用3nm技术节点(N3)双电平负电容场效应管(BLNC-FET),研究了源极/漏极升高的对称下覆铁电双k间隔层对直流和模拟/射频性能的影响。先前的直流分析揭示了BLNC-FET比传统和BL器件具有优势的事实。此外,与双电平FET相比,该器件在${I}_{\text {ON}}$ (ON电流)增强7.2%,在${I}_{\text {OFF}}$ (OFF电流)增强73.58%,亚阈值斜率(SS)达到57.51 mV/dec,势垒上升52.75%。因此,对间隔片的变化进行分析,最终得到高k间隔片长度为5 nm,低k间隔片长度为15 nm的优化尺寸。此后,继续研究BLNC-FET,本工作提出了六种不同的间隔层放置配置,包括对称的下包铁电双k间隔层以及凸起的源/漏极。性能的提高体现在导通电流的增加、负差分电阻(NDR)的降低、SS的提高、${I}_{\text {ON}}$ / ${I}_{\text {OFF}}$比率的提高等方面。本研究发现,通过定位对称搭接双铁电双k间隔材料,将DKSP1中的NDR降低到DKSP6,可以获得最佳结果。在所有间隔层构型中,DKSP6对${I}_{\text {ON}}$、SS、${g}_{m}$(跨导)和跨导产生因子(TGF)分别提高了76.26%、76.19%、319%和317%,DIBL阳性和NDR不存在使DKSP6成为BLNC-FET的较好选择。在电路级分析了所提出器件的性能,设计了CMOS逆变器和五级环形振荡器,并进行了噪声裕度(NM)计算。
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
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