Analysis of hot carrier instability in a floating body cell

IF 1.5 4区 物理与天体物理 Q3 PHYSICS, APPLIED Japanese Journal of Applied Physics Pub Date : 2024-09-03 DOI:10.35848/1347-4065/ad69eb
Hiroomi Nakajima, Tomoaki Shino, Hironobu Furuhashi, Jun Nishimura, Tomoki Higashi, Katsuyuki Fujita, Kosuke Hatsuda, Ryo Fukuda, Takeshi Kajiyama
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Abstract

Hot carrier instability (HCI) in a floating body cell (FBC) has been investigated. The FBC is a dynamic random-access memory (DRAM) made entirely of a silicon-on-insulator (SOI)-MOS without a capacitor. For FBC realization, there is an influence of a physical phenomenon different from the normal MOS because of its structural and operational characteristics of SOI-MOS. The difference between bulk and SOI-MOS is not yet clear, especially for HCI. In this study, we clarified the importance of the structural and geometrical factors of the FBC cell transistor and the SOI-specific floating body effect in the HCI regime of FBCs.
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浮体电池中热载流子不稳定性分析
对浮动体单元(FBC)中的热载流子不稳定性(HCI)进行了研究。FBC 是一种动态随机存取存储器(DRAM),完全由无电容的硅绝缘体(SOI)-MOS 制成。由于 SOI-MOS 的结构和工作特性,在实现 FBC 时会受到不同于普通 MOS 的物理现象的影响。体MOS和SOI-MOS之间的区别尚不明确,特别是在人机交互方面。在这项研究中,我们阐明了 FBC 单元晶体管的结构和几何因素以及 SOI 特定浮体效应在 FBC 的 HCI 机制中的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Japanese Journal of Applied Physics
Japanese Journal of Applied Physics 物理-物理:应用
CiteScore
3.00
自引率
26.70%
发文量
818
审稿时长
3.5 months
期刊介绍: The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS
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