{"title":"3-D Self-Aligned Stacked Ge Nanowires Complementary FET Featuring Single Gate Simple Process","authors":"Yi-Wen Lin;Bo-An Chen;Kai-Wei Huang;Bo-Xu Chen;Guang-Li Luo;Yung-Chun Wu;Fu-Ju Hou","doi":"10.1109/LED.2024.3448477","DOIUrl":null,"url":null,"abstract":"In this study, we experimentally demonstrated a state-of-the-art three-dimensional (3-D) self-aligned stacked hetero-oriented p-type Ge rectangle nanowire (NW) gate-all-around field-effect transistor (GAAFET) on n-type Ge diamond NW GAAFET of single-gate complementary FET (CFET). Anisotropic and isotropic dry etching processes are used to form the stacked NWs. Using Ge as the channel material with its optimal surface orientations of (111) for diamond NW nFET and (110) for rectangle NW pFET can enhance the device performance. The 3-D TCAD simulation indicates outperformance of the CFET device for 1-nm node applications. The proposed CFET structure can simplify the manufacturing technology and be fully compatible with current CMOS technology platform.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 10","pages":"2013-2016"},"PeriodicalIF":4.1000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10644068/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, we experimentally demonstrated a state-of-the-art three-dimensional (3-D) self-aligned stacked hetero-oriented p-type Ge rectangle nanowire (NW) gate-all-around field-effect transistor (GAAFET) on n-type Ge diamond NW GAAFET of single-gate complementary FET (CFET). Anisotropic and isotropic dry etching processes are used to form the stacked NWs. Using Ge as the channel material with its optimal surface orientations of (111) for diamond NW nFET and (110) for rectangle NW pFET can enhance the device performance. The 3-D TCAD simulation indicates outperformance of the CFET device for 1-nm node applications. The proposed CFET structure can simplify the manufacturing technology and be fully compatible with current CMOS technology platform.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.