Cheng-Hao Yu;Hui Yang;Wen-Sheng Zhao;Da-Wei Wang;Hao-Min Guo;Yue Hu;Xiao-Dong Wu;Xin Tan
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Abstract
This paper presents the 2-D numerical simulation results of the ion-induced single-event burnout (SEB) in the conventional gallium-oxide (Ga2O3) Schottky barrier diode (SBD), conventional Ga2O3 heterojunction diode (HJD), and Ga2O3 HJD with a p-NiO junction termination extension (JTE) and a small-angle beveled field plate (BFP). The employed simulation physics models and material parameters are validated by the reverse I-V characteristics in experiments. The simulation results of SEB failure mechanism and threshold voltage in the conventional Ga2O3 SBD are proved by the chlorine (Cl) ion irradiation tests. The most sensitive position and the ion range influence to induce an SEB are discussed. Then, the SEB failure mechanism and threshold voltage of conventional Ga2O3 HJD are comparatively investigated based on the Cl ion strike. Although, the conventional HJD presents much better SEB performance than conventional SBD in anode position, the anode edge of HJD is proved to be very sensitive to an ion. Therefore, the Ga2O3 HJD with JTE and BFP, which can significantly suppress the peak electric field strength at the anode edge, is investigated that has better SEB performance than the conventional SBD and HJD under different ion species.
期刊介绍：
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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