CR-DRAM: Improving DRAM Refresh Energy Efficiency With Inter-Subarray Charge Recycling

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-09-11 DOI:10.1109/TVLSI.2024.3445631
Haitao Du;Hairui Zhu;Song Chen;Yi Kang
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Abstract

A dynamic random access memory (DRAM) relies on periodic refresh operations to prevent data loss caused by charge leakage. As memory capacities continue to grow, refresh power consumption accounts for an increasing proportion of the total DRAM power, and in some contexts, it even becomes a major contributor to power consumption. To address this issue, previous research has explored the tradeoff between DRAM reliability and refresh overhead. However, DRAM reliability degrades as technology nodes advance, making these approaches inapplicable in scenarios, such as servers, where high data reliability is critical. Furthermore, these approaches require modifications to the standard DRAM interface protocol and memory controller (MC), rendering them infeasible for standalone use in computer systems. In this article, we propose an energy-efficient charge-recycling DRAM (CR-DRAM), which enables multiple rounds of charge (i.e., energy) recycling between subarrays within a single autorefresh (AR) process. After refreshing a row, CR-DRAM reuses the charge stored in the bitline (BL) capacitors to supply power for refreshing the next row in another subarray, rather than discharging them directly. Since CR-DRAM is compatible with the joint electron device engineering council (JEDEC) interface standard, it can be easily integrated into modern computer systems. Our circuit-level simulation shows that CR-DRAM significantly reduces AR power consumption by 33.9% compared with conventional DRAM, with a modest area overhead of less than 0.9%. Furthermore, our system-level evaluation shows that CR-DRAM offers an average energy savings of 9.2% (maximum of 11.9%) compared with 8-Gb double data rate 4 (DDR4) DRAM across SPEC-2006 benchmark workloads.
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CR-DRAM:利用子阵列间电荷回收提高 DRAM 刷新能效
动态随机存取存储器(DRAM)依靠周期性的刷新操作来防止电荷泄漏造成的数据丢失。随着内存容量的不断增长,刷新功耗在DRAM总功耗中所占的比例越来越大,在某些情况下,刷新功耗甚至成为功耗的主要贡献者。为了解决这个问题,以前的研究已经探索了DRAM可靠性和刷新开销之间的权衡。然而,随着技术节点的进步,DRAM的可靠性会降低,这使得这些方法不适用于服务器等对数据可靠性要求很高的场景。此外,这些方法需要修改标准的DRAM接口协议和内存控制器(MC),使得它们无法在计算机系统中独立使用。在本文中,我们提出了一种节能的电荷回收DRAM (CR-DRAM),它可以在单个自动刷新(AR)过程中实现子阵列之间的多轮电荷(即能量)回收。刷新一行后,CR-DRAM重用存储在位线(BL)电容中的电荷,为刷新另一子阵列中的下一行供电,而不是直接放电。由于CR-DRAM与联合电子器件工程委员会(JEDEC)接口标准兼容,因此可以轻松集成到现代计算机系统中。我们的电路级模拟表明,与传统DRAM相比,CR-DRAM显着降低了AR功耗33.9%,面积开销小于0.9%。此外,我们的系统级评估显示,在SPEC-2006基准工作负载中,与8gb双数据速率4 (DDR4) DRAM相比,CR-DRAM平均节能9.2%(最高11.9%)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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