Liquid Metal Oxide-Assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics

IF 15.8 1区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY ACS Nano Pub Date : 2024-09-18 DOI:10.1021/acsnano.4c08554
Dasari Venkatakrishnarao, Abhishek Mishra, Yaoju Tarn, Michel Bosman, Rainer Lee, Sarthak Das, Subhrajit Mukherjee, Teymour Talha-Dean, Yiyu Zhang, Siew Lang Teo, Jianwei Chai, Fabio Bussolotti, Kuan Eng Johnson Goh, Chit Siong Lau
{"title":"Liquid Metal Oxide-Assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics","authors":"Dasari Venkatakrishnarao, Abhishek Mishra, Yaoju Tarn, Michel Bosman, Rainer Lee, Sarthak Das, Subhrajit Mukherjee, Teymour Talha-Dean, Yiyu Zhang, Siew Lang Teo, Jianwei Chai, Fabio Bussolotti, Kuan Eng Johnson Goh, Chit Siong Lau","doi":"10.1021/acsnano.4c08554","DOIUrl":null,"url":null,"abstract":"Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform dielectric growth. Here, we report a liquid metal oxide-assisted approach to integrate ultrathin, high-k HfO<sub>2</sub> dielectric on 2D semiconductors with atomically smooth interfaces. Using this approach, we fabricated 2D WS<sub>2</sub> top-gated transistors with subthreshold swings down to 74.5 mV/dec, gate leakage current density below 10<sup>–6</sup> A/cm<sup>2</sup>, and negligible hysteresis. We further demonstrate a one-step van der Waals integration of contacts and dielectrics on graphene. This can offer a scalable approach toward integrating entire prefabricated device stack arrays with 2D materials. Our work provides a scalable solution to address the crucial dielectric engineering challenge for 2D semiconductor-based electronics.","PeriodicalId":21,"journal":{"name":"ACS Nano","volume":null,"pages":null},"PeriodicalIF":15.8000,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Nano","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsnano.4c08554","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform dielectric growth. Here, we report a liquid metal oxide-assisted approach to integrate ultrathin, high-k HfO2 dielectric on 2D semiconductors with atomically smooth interfaces. Using this approach, we fabricated 2D WS2 top-gated transistors with subthreshold swings down to 74.5 mV/dec, gate leakage current density below 10–6 A/cm2, and negligible hysteresis. We further demonstrate a one-step van der Waals integration of contacts and dielectrics on graphene. This can offer a scalable approach toward integrating entire prefabricated device stack arrays with 2D materials. Our work provides a scalable solution to address the crucial dielectric engineering challenge for 2D semiconductor-based electronics.

Abstract Image

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
液态金属氧化物辅助集成高 k 电介质和金属触点以实现二维电子器件
二维范德华半导体在未来的纳米电子学中大有可为。然而,由于惰性范德瓦耳斯材料表面阻碍了电介质的均匀生长,为器件应用集成高k栅极电介质具有挑战性。在此,我们报告了一种液态金属氧化物辅助方法,可在具有原子平滑界面的二维半导体上集成超薄、高k HfO2 介电。利用这种方法,我们制造出了二维 WS2 顶栅晶体管,其亚阈值波动低至 74.5 mV/dec,栅极漏电流密度低于 10-6 A/cm2 且滞后可以忽略不计。我们进一步展示了在石墨烯上一步实现触点和电介质的范德华集成。这为将整个预制器件堆栈阵列与二维材料集成提供了一种可扩展的方法。我们的工作为解决基于二维半导体的电子器件所面临的关键介电工程挑战提供了可扩展的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
ACS Nano
ACS Nano 工程技术-材料科学:综合
CiteScore
26.00
自引率
4.10%
发文量
1627
审稿时长
1.7 months
期刊介绍: ACS Nano, published monthly, serves as an international forum for comprehensive articles on nanoscience and nanotechnology research at the intersections of chemistry, biology, materials science, physics, and engineering. The journal fosters communication among scientists in these communities, facilitating collaboration, new research opportunities, and advancements through discoveries. ACS Nano covers synthesis, assembly, characterization, theory, and simulation of nanostructures, nanobiotechnology, nanofabrication, methods and tools for nanoscience and nanotechnology, and self- and directed-assembly. Alongside original research articles, it offers thorough reviews, perspectives on cutting-edge research, and discussions envisioning the future of nanoscience and nanotechnology.
期刊最新文献
Liquid Metal Oxide-Assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics High-Density Atomically Dispersed Metals Activate Adjacent Nitrogen/Carbon Sites for Efficient Ammonia Electrosynthesis from Nitrate Molten Salt Modulation of Potassium–Nitrogen–Carbon for the Breaking Kinetics Bottleneck of Photocatalytic Overall Water Splitting and Environmental Impact Reduction Structure and Defect Identification at Self-Assembled Islands of CO2 Using Scanning Probe Microscopy Monomer Composition as a Mechanism to Control the Self-Assembly of Diblock Oligomeric Peptide–Polymer Amphiphiles
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1