Effect of Y on the microstructure and physical properties of Cu-Zr-Mg-Y alloys

IF 3.9 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-12-01 Epub Date: 2024-09-14 DOI:10.1016/j.vacuum.2024.113651
Haoyan Hu , Meng Zhou , Xu Li , Yi Zhang , Qian Bai , Bo Yang , Jin Zou , Ke Jing , Zheng'ao Li , Gang'ao Xin , Baohong Tian , Alex A. Volinsky
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Abstract

This work presents the development of two novel Cu-Zr-Mg(Y) alloys. The alloys were prepared using vacuum melting and show good conductivity and mechanical properties after solution treatment+60 % cold rolling + aging at 450 °C for 60 min.

The measurement results reveal that the Cu-Zr-Mg alloy has a microhardness of 165 ± 5 HV, an electrical conductivity of 68.5 ± 0.2 % IACS and a tensile strength of 483 ± 15 MPa while the Cu-Zr-Mg-Y alloy has a microhardness of 172 ± 6 HV, an electrical conductivity of 67.9 ± 0.2 % IACS and a tensile strength of 503 ± 12 MPa.

The addition of Y promotes the recovery and recrystallization of the alloys and causes the refinement of the grain size. The appearance of copper texture is the reason why the Cu-Zr-Mg-Y alloy has higher tensile strength in the rolling direction. The main phases of the Cu-Zr-Mg-Y alloy consist of Cu5Zr and a small amount of Mg24Y5. The increment in precipitation strengthening is primarily attributed to the coherent Cu5Zr phase within the matrix.

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Y 对 Cu-Zr-Mg-Y 合金微观结构和物理性质的影响
这项工作展示了两种新型铜-Zr-镁(Y)合金的开发。测量结果显示,Cu-Zr-Mg 合金的显微硬度为 165 ± 5 HV,导电率为 68.5 ± 0.2 % IACS,抗拉强度为 483 ± 15 MPa。测量结果显示,Cu-Zr-Mg 合金的显微硬度为 165 ± 5 HV,电导率为 68.5 ± 0.2 % IACS,抗拉强度为 483 ± 15 MPa,而 Cu-Zr-Mg-Y 合金的显微硬度为 172 ± 6 HV,电导率为 67.9 ± 0.2 % IACS,抗拉强度为 503 ± 12 MPa。铜纹理的出现是 Cu-Zr-Mg-Y 合金在轧制方向上具有较高抗拉强度的原因。Cu-Zr-Mg-Y 合金的主要相由 Cu5Zr 和少量 Mg24Y5 组成。沉淀强化的增加主要归因于基体中相干的 Cu5Zr 相。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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