Oleg Kul , Alexey Vasiliev , Alexey Shaposhnik , Andrey Nikitin , Anna Dmitrieva , Alexandr Bolshakov , Zhifu Liu , Mingsheng Ma , Artem Mokrushin , Nikolay Simonenko , Elizaveta Simonenko
{"title":"Novel screen-printed ceramic MEMS microhotplate for MOS sensors","authors":"Oleg Kul , Alexey Vasiliev , Alexey Shaposhnik , Andrey Nikitin , Anna Dmitrieva , Alexandr Bolshakov , Zhifu Liu , Mingsheng Ma , Artem Mokrushin , Nikolay Simonenko , Elizaveta Simonenko","doi":"10.1016/j.sna.2024.115907","DOIUrl":null,"url":null,"abstract":"<div><p>We developed a new approach to the fabrication of MEMS substrates for MOS gas sensors. This full screen-printing process is based on the application of sacrificial material, which is solid at the near-room temperature of printing and turns to powder after the firing of the elements of the sensor. Therefore, this sacrificial material can be removed from under the suspended elements of the MEMS structure in ultrasonic bath. The glass-ceramic MEMS is a cantilever structure equipped with a Pt-based microheater made of Pt resistive material with sheet resistance of about 4 Ohm/square fabricated using core-shell technology. It is located at the end edge of the cantilever and is isolated from the contacts to the sensing layer by glass-ceramic insulation. Screen-printing provides cheap fabrication, robustness and low power (∼120 mW@450°C) of the sensing element. The functionality of the microhotplate was checked using ZnO nanomaterial deposited by microextruder, it demonstrated high response and selectivity of ZnO material to NO<sub>2</sub> (response 41.6 at 200°C for 10 ppm).</p></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"379 ","pages":"Article 115907"},"PeriodicalIF":4.9000,"publicationDate":"2024-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424724009014","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
We developed a new approach to the fabrication of MEMS substrates for MOS gas sensors. This full screen-printing process is based on the application of sacrificial material, which is solid at the near-room temperature of printing and turns to powder after the firing of the elements of the sensor. Therefore, this sacrificial material can be removed from under the suspended elements of the MEMS structure in ultrasonic bath. The glass-ceramic MEMS is a cantilever structure equipped with a Pt-based microheater made of Pt resistive material with sheet resistance of about 4 Ohm/square fabricated using core-shell technology. It is located at the end edge of the cantilever and is isolated from the contacts to the sensing layer by glass-ceramic insulation. Screen-printing provides cheap fabrication, robustness and low power (∼120 mW@450°C) of the sensing element. The functionality of the microhotplate was checked using ZnO nanomaterial deposited by microextruder, it demonstrated high response and selectivity of ZnO material to NO2 (response 41.6 at 200°C for 10 ppm).
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...