Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Abstract

Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable in situ conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.