{"title":"Architectural Exploration for Waferscale Switching System","authors":"Zhiquan Wan;Zhipeng Cao;Shunbin Li;Peijie Li;Qingwen Deng;Weihao Wang;Kun Zhang;Guandong Liu;Ruyun Zhang;Qinrang Liu","doi":"10.1109/TVLSI.2024.3455332","DOIUrl":null,"url":null,"abstract":"With the end of Moore’s law and Dennard scaling, waferscale systems or processors that integrate multiple pre-tested known good dies (KGDs) on a waferscale-interposer are new approaches to further improve the chiplet-based system’s performance. This article explores the network on wafer (NoW) architecture of waferscale switching system under several physical constraints. A software-based approach is proposed to redefine the topological property. A five-level butterfly fat-tree (BFT)-like logical topology with 8.96-Tb/s (896 ports <inline-formula> <tex-math>$\\times 10$ </tex-math></inline-formula> Gb/s/port) switching bandwidth is achieved based on 2-D-mesh-like physical topology. We show that the proposed BFT-like topology with breadth-first-search (BFS) based traffic balanced routing algorithm reduces 55.6% hops, 41.4% transmission delay, and improves 24.2% throughput compared to 2-D-mesh-like topology under different traffic distributions. This BFT-like waferscale switching system is suitable for high-performance computing and data centers. In addition, the numerical analysis shows that the waferscale package can provide significant power efficiency and latency advantages compared to the typical single-chip package, which mainly benefits from the short-reach IO requirements. Note that the proposed waferscale switching system is compatible with high-switch-capacity dies with advanced process technology, which can further improve system performance. Finally, we present the physical implementations for the waferscale system with heterogeneous dies.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 2","pages":"512-524"},"PeriodicalIF":2.8000,"publicationDate":"2024-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10682064","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10682064/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
With the end of Moore’s law and Dennard scaling, waferscale systems or processors that integrate multiple pre-tested known good dies (KGDs) on a waferscale-interposer are new approaches to further improve the chiplet-based system’s performance. This article explores the network on wafer (NoW) architecture of waferscale switching system under several physical constraints. A software-based approach is proposed to redefine the topological property. A five-level butterfly fat-tree (BFT)-like logical topology with 8.96-Tb/s (896 ports $\times 10$ Gb/s/port) switching bandwidth is achieved based on 2-D-mesh-like physical topology. We show that the proposed BFT-like topology with breadth-first-search (BFS) based traffic balanced routing algorithm reduces 55.6% hops, 41.4% transmission delay, and improves 24.2% throughput compared to 2-D-mesh-like topology under different traffic distributions. This BFT-like waferscale switching system is suitable for high-performance computing and data centers. In addition, the numerical analysis shows that the waferscale package can provide significant power efficiency and latency advantages compared to the typical single-chip package, which mainly benefits from the short-reach IO requirements. Note that the proposed waferscale switching system is compatible with high-switch-capacity dies with advanced process technology, which can further improve system performance. Finally, we present the physical implementations for the waferscale system with heterogeneous dies.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.