Graphene-Based Absorptive Gasket for Chip Packages With Enhanced Radiation-Suppression and Heat-Dissipation Capabilities

Abstract

To overcome electromagnetic interference (EMI) and thermal management issues in chip packages with metal lids or heat sinks, an innovative graphene-based absorptive gasket is proposed in this article. It comprises a dielectric layer and two identical lossy layers that are constituted of printed resistive graphene film with a specific pattern. The proposed gasket can be applied to the bottom of lids/heat sinks, introducing efficient absorption of electromagnetic (EM) energy emitted from internal interconnects and chip circuits in the Ku- and K-bands. Moreover, the presence of the gasket dramatically suppresses the initial parallel-plate mode resonances inside the chip package by means of shifting them to lower frequencies. As a result, the total radiated power (TRP) of the entire chip module can be significantly reduced over a frequency range of 2–28 GHz. Furthermore, the heat dissipation performance of the chip package applying the proposed gasket is enhanced considerably due to the distinguished thermal properties of graphene film. Experimental validations are conducted to verify the benefits of applying the proposed gasket. Fairly good agreements between the simulated and measured results are obtained.