{"title":"A combined transport-defect evolution model of microstructure damage in silicon carbide induced by precise irradiation of focused helium ion beams","authors":"","doi":"10.1016/j.vacuum.2024.113656","DOIUrl":null,"url":null,"abstract":"<div><div>In this paper, a combined transport-defect evolution multiscale model describing the generation and the evolution of microstructure damage in silicon carbide (SiC) induced by focused helium ion beams is developed. In the proposed model, the transport of helium ions and displaced atoms in the SiC substrate and the generation of point defects are described by the Boltzmann transport equations, while the subsequent defect evolution is characterized by a set of rate equations with the contributions of the modeling of the bubble coalescence as well as the substrate swelling. The validity and superiority of the transport equations are verified by comparing the simulation results with the data from experimental measurements and available simulation methods. The subsurface amorphous profile, onsurface swelling profile, and the spatial and size distribution of helium bubbles in a SiC substrate irradiated by focused helium ion beams are simulated using the proposed multiscale model. The damage morphology simulated by the proposed model is in good agreement with the transmission electron microscopy images at different beam energies and doses. This work provides an effective tool for full-stage modeling of complex evolutionary mechanisms of microstructure damage induced by precise and high-throughput helium irradiation.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24007024","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, a combined transport-defect evolution multiscale model describing the generation and the evolution of microstructure damage in silicon carbide (SiC) induced by focused helium ion beams is developed. In the proposed model, the transport of helium ions and displaced atoms in the SiC substrate and the generation of point defects are described by the Boltzmann transport equations, while the subsequent defect evolution is characterized by a set of rate equations with the contributions of the modeling of the bubble coalescence as well as the substrate swelling. The validity and superiority of the transport equations are verified by comparing the simulation results with the data from experimental measurements and available simulation methods. The subsurface amorphous profile, onsurface swelling profile, and the spatial and size distribution of helium bubbles in a SiC substrate irradiated by focused helium ion beams are simulated using the proposed multiscale model. The damage morphology simulated by the proposed model is in good agreement with the transmission electron microscopy images at different beam energies and doses. This work provides an effective tool for full-stage modeling of complex evolutionary mechanisms of microstructure damage induced by precise and high-throughput helium irradiation.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.