Comprehensive Understanding of the Mobility Scattering Mechanisms and Evaluation of the Universal Mobility in Ultra-Thin-Body Ge-OI p- and n-MOSFETs

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-09-20 DOI:10.1109/TED.2024.3422951
Rui Su;Zhuo Chen;Mengnan Ke;Dawei Gao;Walter Schwarzenbach;Bich-Yen Nguyen;Junkang Li;Rui Zhang
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Abstract

The mobility scattering mechanisms in the ultra-thin-body (UTB) Ge-OI p- and n-MOSFETs have been systematically investigated. It is found that the ${E} _{\text {eff}}^{-{2}}$ dependence is confirmed for the hole mobility in Ge-OI pMOSFETs, while the electron mobility exhibits an unusually strong dependence on ${E} _{\text {eff}}$ ( $\propto {E} _{\text {eff}}^{-{4}}\text {)}$ . The $\mu _{\text {ph}}$ exhibits an ${E} _{\text {eff}}^{\,{-{0}.{3}}}$ dependence for both holes and electrons, along with a temperature dependence of $\sim {T} ^{\,{-{1}.{8}}}$ . The $\mu _{\text {total}}$ is measured at different depletion layer carrier densities ( ${N} _{\text {depl}}\text {)}$ , revealing that $\mu _{\text {Coulomb}}$ increases with the rise of ${N} _{\text {depl}}$ . Specially, $\mu _{\text {Coulomb}}$ exhibits ${N} _{\text {depl}}^{{0}.{5}}$ and ${N} _{\text {depl}}^{{1}.{8}}$ dependencies for electrons and holes, respectively. Consequently, more pronounced mobility degradation has been confirmed in UTB Ge-OI nMOSFETs than in UTB Ge-OI pMOSFETs. These findings suggest universal carrier scattering mechanisms for both holes and electrons in UTB Ge-OI channels, which are valuable for understanding carrier transport in thin-channel Ge devices for future advanced technology nodes.
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全面了解超薄体 Ge-OI p- 和 n-MOSFET 的迁移率散射机制并评估其通用迁移率
我们系统地研究了超薄体 (UTB) Ge-OI p- 和 n-MOSFET 中的迁移率散射机制。研究发现_{\text {eff}}^{-{2}}$ 的依赖性在 Ge-OI pMOSFET 中得到了证实,而电子迁移率对 ${E} 的依赖性异常强烈。_{text {eff}}$ ( $\propto {E} _{\text {eff}}^{-{4}}\text {)}$。$\mu _{text {ph}}$展示了一个${E}_{text {eff}}$ 。对于空穴和电子来说,${text {eff}}^{\,{-{0}.{3}}$ 与温度有关,与$\sim {T} 有关。}^{\,{-{1}.{8}}}$ .在不同的耗尽层载流子密度(${N} _{\text {depl}}\text {)}$下测量的 $\mu _{text {total}}$ 显示,${N} _{\text {Coulomb}}$ 随着 ${N} 的上升而增加。{text {depl}}$ 。特别地, $\mu _{text {Coulomb}}$ 表现出 ${N} _{text {depl}}$ 。{{text {depl}}^{{0}.{5}}}$和 ${N} {{text {depl}}^{{0}.{5}}}$。电子和空穴分别与_{text {depl}}^{1}.{8}}$ 有关。因此,与UTB Ge-OI pMOSFET 相比,UTB Ge-OI nMOSFET 的迁移率下降更为明显。这些发现表明,UTB Ge-OI 沟道中的空穴和电子都具有普遍的载流子散射机制,这对于理解未来先进技术节点的薄沟道 Ge 器件中的载流子传输非常有价值。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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