Unravelling electromechanical mechanism of mechanoreceptor inspired capacitive pressure sensor considering size effect

IF 3.4 3区 工程技术 Q1 MECHANICS International Journal of Solids and Structures Pub Date : 2024-09-24 DOI:10.1016/j.ijsolstr.2024.113083
Wenxuan Ding , Yonglin Chen , Wenbin Kang , Zhuangjian Liu , Peng Wang , Weidong Yang
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Abstract

The rapid development of intelligent sensing technologies, including electronic skins, wearable devices and robots, has put forward an urgent demand for various tactile biomimetic sensors. However, the design of tactile sensors is mostly based on independent experimental research and lack theoretical guidance at present. In this work, drawing inspiration from human skin microstructure mechanoreceptors responsible for tactile sensation, we proposed a capacitive pressure sensor model featuring a biomimetic conformal microstructured electrode with a round-crown shape. Moreover, at the micrometer scale, size effect profoundly influences the mechanical behavior of sensing materials and microstructured devices. Firstly, we conducted in-depth research on the electromechanical behavior of conformal microstructured electrode pressure sensor, considering the size effect based on couple stress elasticity and Hertz contact theory. We validated the effectiveness of the model by comparing it with experimental and simulation results of human skin. Through numerical simulation, we further verified that the theoretical model of a single microstructured electrode can be utilized for calculating microstructured electrode arrays. Furthermore, our analysis reveals that the geometric morphology and material properties of the dielectric layer, the arrangement density of the microstructured electrode arrays, along with the radius of the round-crown shaped microstructured electrode are the dominant parameters influencing the electromechanical sensitivity through parameter analysis. Finally, we devised a high-k (high dielectric permittivity) polymer composites dielectric layer with a tunable Poisson’s ratio structure, offering a feasible approach to achieving highly sensitive capacitive microstructure sensors. This theoretical model that takes into account the size effect in microstructured electrode contact problem provides theoretical insights that can guide the optimization design of high-performance tactile sensors.

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考虑尺寸效应,揭示受机械感受器启发的电容式压力传感器的机电机制
电子皮肤、可穿戴设备和机器人等智能传感技术的快速发展,对各种触觉仿生传感器提出了迫切需求。然而,目前触觉传感器的设计大多基于独立的实验研究,缺乏理论指导。在这项工作中,我们从负责触觉感受的人体皮肤微结构机械感受器中汲取灵感,提出了一种电容式压力传感器模型,其特点是具有圆冠形状的仿生物共形微结构电极。此外,在微米尺度上,尺寸效应深刻影响着传感材料和微结构器件的机械行为。首先,我们基于耦合应力弹性和赫兹接触理论,考虑尺寸效应,对保形微结构电极压力传感器的机电行为进行了深入研究。通过与人体皮肤的实验和仿真结果进行比较,我们验证了模型的有效性。通过数值模拟,我们进一步验证了单个微结构电极的理论模型可用于计算微结构电极阵列。此外,通过参数分析,我们发现介电层的几何形态和材料特性、微结构电极阵列的排列密度以及圆冠形微结构电极的半径是影响机电灵敏度的主要参数。最后,我们设计了一种具有可调泊松比结构的高 k(高介电常数)聚合物复合材料介电层,为实现高灵敏度电容式微结构传感器提供了一种可行的方法。该理论模型考虑了微结构电极接触问题中的尺寸效应,为高性能触觉传感器的优化设计提供了理论依据。
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来源期刊
CiteScore
6.70
自引率
8.30%
发文量
405
审稿时长
70 days
期刊介绍: The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field. Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.
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