Review of Thermal Design of SiC Power Module for Motor Drive in Electrical Vehicle Application

Abstract

In the current vehicle electric propulsion systems, the thermal design of power modules heavily relies on empirical knowledge, making it challenging to effectively optimize irregularly arranged Pinfin structures, thereby limiting their performance. This paper aims to review the underlying mechanisms of how irregularly arranged Pinfins influence the thermal characteristics of power modules and introduce collaborative thermal design with DC bus capacitor and motor. Literature considers chip size, placement, coolant flow direction with the goal of reducing thermal resistance of power modules, minimizing chip junction temperature differentials, and optimizing Pinfin layouts. In the first step, algorithms should efficiently generating numerous unique irregular Pinfin layouts to enhance optimization quality. The second step is to efficiently evaluate Pinfin layouts. Simulation accuracy and speed should be ensured to improve computational efficiency. Finally, to improve overall heat dissipation effectiveness, papers establish models for capacitors, motors, to aid collaborative Pinfin optimization. These research outcomes will provide essential support for future developments in high power density motor drive for vehicles.