{"title":"Multifunctional Molecule-Assisted Crystallization Control for Efficient Perovskite Light-Emitting Diodes","authors":"Wanxing Yang;Chengxi Zhang;Jun Dai;Xuyong Yang;Xiaoyang Zhang;Tong Zhang","doi":"10.1109/LED.2024.3446993","DOIUrl":null,"url":null,"abstract":"Three-dimensional (3D) perovskite with good charge transport and structural stability, showing application potential in light-emitting diodes (LED). However, the grain size of 3D perovskite in the liquid-solid process is relatively large and large amounts of defects on the grain surface and grain boundaries were produced, leading to a reduced efficiency of LED devices. Herein, we report a dual rivet strategy to regulate perovskite growth kinetics in liquid-solid processes by introducing 3-(Hydroxy(phenyl) phosphoryl)propanoic acid (CEPPA) into the perovskite precursor. CEPPA has a dual coordination functional group, which can simultaneously form covalent bonds with two uncoordinated lead atoms on the surface of perovskite, effectively controlling the crystals during the liquid-solid process and obtaining high-quality perovskite films with smaller grain sizes. Moreover, the coordination of CEPPA with Pb atoms on the surface of perovskite can effectively reduce film defects and thus improve the efficiency of radiation recombination. The functional molecule double rivet strategy is beneficial to the preparation of high-performance 3D perovskite LEDs with peak external quantum efficiencies exceeding 20% and with a maximum brightness of 17795 cd m\n<sup>-2</sup>\n.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 10","pages":"1895-1898"},"PeriodicalIF":4.1000,"publicationDate":"2024-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10643083/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Three-dimensional (3D) perovskite with good charge transport and structural stability, showing application potential in light-emitting diodes (LED). However, the grain size of 3D perovskite in the liquid-solid process is relatively large and large amounts of defects on the grain surface and grain boundaries were produced, leading to a reduced efficiency of LED devices. Herein, we report a dual rivet strategy to regulate perovskite growth kinetics in liquid-solid processes by introducing 3-(Hydroxy(phenyl) phosphoryl)propanoic acid (CEPPA) into the perovskite precursor. CEPPA has a dual coordination functional group, which can simultaneously form covalent bonds with two uncoordinated lead atoms on the surface of perovskite, effectively controlling the crystals during the liquid-solid process and obtaining high-quality perovskite films with smaller grain sizes. Moreover, the coordination of CEPPA with Pb atoms on the surface of perovskite can effectively reduce film defects and thus improve the efficiency of radiation recombination. The functional molecule double rivet strategy is beneficial to the preparation of high-performance 3D perovskite LEDs with peak external quantum efficiencies exceeding 20% and with a maximum brightness of 17795 cd m
-2
.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.