Investigation of the Effect of Single Abrasive Grain Cutting Factors on Trace Microrelief on the Workpiece Surface Using Finite Element Modeling

IF 0.4 Q4 ENGINEERING, MECHANICAL Journal of Machinery Manufacture and Reliability Pub Date : 2024-02-08 DOI:10.1134/S1052618823100138
L. V. Shipulin, A. A. Frolov, E. I. Shulezhko
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Abstract

A problem is formulated to investigate the influence of various factors of a single grain cutting process on the formed microrelief of the grain trace on the workpiece surface, such as the grain shape and cutting depth. Based on finite element modeling in the ANSYS finite element analysis software system in the Workbench environment of the interaction of abrasive grain with the workpiece, studies were carried out and the values of the geometric parameters of the microrelief of grain trace on the workpiece surface were obtained: depth, width, and mark area in the cross section, as well as the width, height, and area of the left and right piles in cross section. In addition to the geometric characteristics, the coefficient of material pushed into heaps was determined. The research methodology used made it possible to obtain the geometric characteristics of the microrelief of the trace from the abrasive grain and to determine their dependence on the cutting process factors: the abrasive grain shape and the depth of its penetration into the workpiece.

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利用有限元建模研究单磨粒切削因数对工件表面微量浮雕的影响
本文提出了一个问题,以研究单磨粒切削过程中各种因素(如磨粒形状和切削深度)对工件表面磨粒痕迹形成的微浮雕的影响。基于 ANSYS 有限元分析软件系统在 Workbench 环境下对磨粒与工件的相互作用进行有限元建模,研究并获得了工件表面磨粒痕迹微凸起的几何参数值:横截面上的深度、宽度和标记面积,以及横截面上左和右桩的宽度、高度和面积。除几何特征外,还测定了推入堆中的材料系数。通过采用这种研究方法,可以获得磨粒痕迹微凹凸的几何特征,并确定其与切削工艺因素(磨粒形状及其渗入工件的深度)之间的关系。
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来源期刊
CiteScore
0.80
自引率
33.30%
发文量
61
期刊介绍: Journal of Machinery Manufacture and Reliability  is devoted to advances in machine design; CAD/CAM; experimental mechanics of machines, machine life expectancy, and reliability studies; machine dynamics and kinematics; vibration, acoustics, and stress/strain; wear resistance engineering; real-time machine operation diagnostics; robotic systems; new materials and manufacturing processes, and other topics.
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