The use of molecular dynamics method to evaluate the thermo-physical properties of Cu nanoparticles dispersed in Paraffin wax PCM

IF 5.5 3区 工程技术 Q1 ENGINEERING, CHEMICAL Journal of the Taiwan Institute of Chemical Engineers Pub Date : 2024-10-02 DOI:10.1016/j.jtice.2024.105785
Aliakbar Karimipour , Saeed A. Asiri , Khaled M. Alfawaz , Ageel F. Alogla , Nidal H. Abu-Hamdeh , PHH Viet
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Abstract

Background

One of paraffin wax's most significant practical applications is for thermal energy storage (TES). Phase change materials (PCMs), such as paraffin wax, are being investigated to store thermal energy in various applications, from building heating and cooling systems to solar power plants. Adding copper nanoparticles (NPs) to the paraffin wax can enhance the mixture's performance. Another potential application of the paraffin wax-copper nanofluid model is in the development of advanced cooling systems.

Methods

The present research aims to evaluate the effects of different panel temperatures (Temps) on the thermal performance (TP) and electrical efficiency (EE) of paraffin wax-Cu nanofluid (NF) between parallel plates via the Molecular Dynamics (MD) method by using the LAMMPS simulation software.

Significant Findings

As the simulation progresses, the atomic structure undergoes significant changes in energy and TP. The potential energy (PE) decreases and stabilizes at -12,444.55 eV after 100,000 time steps, while the kinetic energy (KE) reaches a steady value of 763.51 eV. The nanoparticles (NP) in the middle of the wall exhibit the highest velocity, peaking at 0.002 Å/ps, and the maximum Temp is recorded at 334.08 K in the wall's center. Over time, the structure's TC stabilizes at 0.3199 W/m.K after 2 ns. However, increasing the wall Temp from 300 K to 400 K leads to an increase in nanoparticle velocity, from 0.02 Å/ps to 0.0283 Å/ps, and raises the maximum Temp from 334.08 K to 406.05. This temp rise also slightly improves the TC from 0.319 W/m.K to 0.325 W/m.K, but it causes a significant 84 % decrease in EE, highlighting the critical impact of Temp on the structure's behavior.

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使用分子动力学方法评估分散在石蜡 PCM 中的铜纳米粒子的热物理性质
背景石蜡最重要的实际应用之一是热能储存(TES)。人们正在研究石蜡等相变材料(PCM)在各种应用中的热能存储,从建筑供暖和制冷系统到太阳能发电厂。在石蜡中添加纳米铜粒子(NPs)可以提高混合物的性能。本研究旨在利用 LAMMPS 仿真软件,通过分子动力学(MD)方法评估不同面板温度(Temps)对平行板间石蜡-铜纳米流体(NF)的热性能(TP)和电效率(EE)的影响。势能(PE)降低,并在 100,000 个时间步后稳定在-12,444.55 eV,而动能(KE)达到稳定值 763.51 eV。位于壁中间的纳米粒子(NP)表现出最高的速度,峰值为 0.002 Å/ps,壁中心的最大温度为 334.08 K。随着时间的推移,结构的 TC 在 2 ns 后稳定在 0.3199 W/m.K。然而,将壁温从 300 K 提高到 400 K 会导致纳米粒子速度从 0.02 Å/ps 提高到 0.0283 Å/ps,并将最大温度从 334.08 K 提高到 406.05。温度的升高也略微改善了热传导系数,从 0.319 W/m.K 提高到 0.325 W/m.K,但导致 EE 显著下降 84%,突出了温度对结构行为的关键影响。
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来源期刊
CiteScore
9.10
自引率
14.00%
发文量
362
审稿时长
35 days
期刊介绍: Journal of the Taiwan Institute of Chemical Engineers (formerly known as Journal of the Chinese Institute of Chemical Engineers) publishes original works, from fundamental principles to practical applications, in the broad field of chemical engineering with special focus on three aspects: Chemical and Biomolecular Science and Technology, Energy and Environmental Science and Technology, and Materials Science and Technology. Authors should choose for their manuscript an appropriate aspect section and a few related classifications when submitting to the journal online.
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