{"title":"An improved infrared image post-processing method for metals and composites","authors":"Dan Wu, Yifan Wang, Zhifei Miao, Chenghao Wu","doi":"10.1016/j.infrared.2024.105576","DOIUrl":null,"url":null,"abstract":"<div><div>Post-processing of the infrared thermography image is crucial for nondestructive testing, which will reduce noise and disturbance considerably. In this work, an improved image post-processing method based on the temperature ratio is proposed, namely the Thermal Image Division (TID) method. To validate this method, we carried out experiments on different materials such as composite CFRP (carbon fiber reinforced polymer) plates, 304 stainless steel plates and aluminum alloy samples. The results show the proposed method is pretty useful, significantly improves the signal-to-noise ratio of the image by comparing with other post-processing methods. It’s not only beneficial for identifying the edge of the defect, but also facilitates the detection of smaller defects with deeper depth. The signal-to-noise ratio is improved by nearly 117.5 % from practice. The TID method was applied to the defect size detection of pulse thermography and ultrasonic thermography. The results indicate TID method has good robustness, significantly reduces the error of defect size quantification.</div></div>","PeriodicalId":13549,"journal":{"name":"Infrared Physics & Technology","volume":"142 ","pages":"Article 105576"},"PeriodicalIF":3.1000,"publicationDate":"2024-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Infrared Physics & Technology","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1350449524004602","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0
Abstract
Post-processing of the infrared thermography image is crucial for nondestructive testing, which will reduce noise and disturbance considerably. In this work, an improved image post-processing method based on the temperature ratio is proposed, namely the Thermal Image Division (TID) method. To validate this method, we carried out experiments on different materials such as composite CFRP (carbon fiber reinforced polymer) plates, 304 stainless steel plates and aluminum alloy samples. The results show the proposed method is pretty useful, significantly improves the signal-to-noise ratio of the image by comparing with other post-processing methods. It’s not only beneficial for identifying the edge of the defect, but also facilitates the detection of smaller defects with deeper depth. The signal-to-noise ratio is improved by nearly 117.5 % from practice. The TID method was applied to the defect size detection of pulse thermography and ultrasonic thermography. The results indicate TID method has good robustness, significantly reduces the error of defect size quantification.
期刊介绍:
The Journal covers the entire field of infrared physics and technology: theory, experiment, application, devices and instrumentation. Infrared'' is defined as covering the near, mid and far infrared (terahertz) regions from 0.75um (750nm) to 1mm (300GHz.) Submissions in the 300GHz to 100GHz region may be accepted at the editors discretion if their content is relevant to shorter wavelengths. Submissions must be primarily concerned with and directly relevant to this spectral region.
Its core topics can be summarized as the generation, propagation and detection, of infrared radiation; the associated optics, materials and devices; and its use in all fields of science, industry, engineering and medicine.
Infrared techniques occur in many different fields, notably spectroscopy and interferometry; material characterization and processing; atmospheric physics, astronomy and space research. Scientific aspects include lasers, quantum optics, quantum electronics, image processing and semiconductor physics. Some important applications are medical diagnostics and treatment, industrial inspection and environmental monitoring.