R. Pashaie, M. M. Shokrieh, M. Vahedi, A. H. Mirzaei, S. Akbari
{"title":"A comparative study of residual stress measurement of laminated composites using FBG sensor, DIC technique, and strain gauge","authors":"R. Pashaie, M. M. Shokrieh, M. Vahedi, A. H. Mirzaei, S. Akbari","doi":"10.1007/s11082-024-07676-x","DOIUrl":null,"url":null,"abstract":"<div><p>Residual stresses adversely influence the strength of polymeric composites and could result in premature failure, warpage, delamination, and matrix cracking. Therefore, residual stress measurement is necessary to predict their effects on the performance of polymeric composites. The primary focus of this study is to compare the performance of the fiber Bragg grating (FBG) sensor for residual stress measurement with that of the digital image correlation (DIC) and strain gauge which are the most commonly used methods in this field. This comparison is of significant importance as it can provide valuable insights into the effectiveness of these techniques in measuring cure-induced residual stresses in polymeric composites. The incremental slitting process was conducted to compare the accuracy and the performance of the FBG sensor with the DIC and strain gauge. The residual stresses were also evaluated using the classical lamination theory (CLT). The 2% difference was achieved between the recorded data by FBGs before and after slitting. The present study also involves monitoring the curing cycle and determining the created residual strains at the end of this process using the FBGs without resorting to destructive methods such as hole-drilling or slitting.</p></div>","PeriodicalId":720,"journal":{"name":"Optical and Quantum Electronics","volume":null,"pages":null},"PeriodicalIF":3.3000,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical and Quantum Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11082-024-07676-x","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Residual stresses adversely influence the strength of polymeric composites and could result in premature failure, warpage, delamination, and matrix cracking. Therefore, residual stress measurement is necessary to predict their effects on the performance of polymeric composites. The primary focus of this study is to compare the performance of the fiber Bragg grating (FBG) sensor for residual stress measurement with that of the digital image correlation (DIC) and strain gauge which are the most commonly used methods in this field. This comparison is of significant importance as it can provide valuable insights into the effectiveness of these techniques in measuring cure-induced residual stresses in polymeric composites. The incremental slitting process was conducted to compare the accuracy and the performance of the FBG sensor with the DIC and strain gauge. The residual stresses were also evaluated using the classical lamination theory (CLT). The 2% difference was achieved between the recorded data by FBGs before and after slitting. The present study also involves monitoring the curing cycle and determining the created residual strains at the end of this process using the FBGs without resorting to destructive methods such as hole-drilling or slitting.
期刊介绍:
Optical and Quantum Electronics provides an international forum for the publication of original research papers, tutorial reviews and letters in such fields as optical physics, optical engineering and optoelectronics. Special issues are published on topics of current interest.
Optical and Quantum Electronics is published monthly. It is concerned with the technology and physics of optical systems, components and devices, i.e., with topics such as: optical fibres; semiconductor lasers and LEDs; light detection and imaging devices; nanophotonics; photonic integration and optoelectronic integrated circuits; silicon photonics; displays; optical communications from devices to systems; materials for photonics (e.g. semiconductors, glasses, graphene); the physics and simulation of optical devices and systems; nanotechnologies in photonics (including engineered nano-structures such as photonic crystals, sub-wavelength photonic structures, metamaterials, and plasmonics); advanced quantum and optoelectronic applications (e.g. quantum computing, memory and communications, quantum sensing and quantum dots); photonic sensors and bio-sensors; Terahertz phenomena; non-linear optics and ultrafast phenomena; green photonics.