Manipulating Band-to-Band Tunneling Current in Low-Voltage pMOS Devices in BCD Technology: A TCAD and Experimental Investigation

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-10-04 DOI:10.1109/TED.2024.3466842
Guglielmo Albani;Elena Rebussi;Emanuele D’Ambrosio;Annalisa Gilardini;Alessandra Manca;Pietro Miccichè;Daria Doria;Pierpaolo Monge;Elia Sora;Silvia Vangelista;Emanuele Viganò
{"title":"Manipulating Band-to-Band Tunneling Current in Low-Voltage pMOS Devices in BCD Technology: A TCAD and Experimental Investigation","authors":"Guglielmo Albani;Elena Rebussi;Emanuele D’Ambrosio;Annalisa Gilardini;Alessandra Manca;Pietro Miccichè;Daria Doria;Pierpaolo Monge;Elia Sora;Silvia Vangelista;Emanuele Viganò","doi":"10.1109/TED.2024.3466842","DOIUrl":null,"url":null,"abstract":"This study investigates the issue of reducing band-to-band leakage current in low-voltage (LV) CMOS devices realized using BCD technology. Through TCAD simulations and comprehensive experimental characterization, the influence of key process parameters on leakage current in this category of devices is examined. The presented findings suggest that band-to-band tunneling (B2B) can be significantly mitigated by carefully selecting the rapid thermal processing (RTP) annealing temperature. Subsequently, we address the side effects of the modification of the process parameter on the electrical performance of the devices, aiming to recover affected electrical figures of merit through precise adjustments to the process working point. The study shows that this goal can be reached by a proper modification of the p+ implant energy. In the end, a statistical analysis is presented, with the purpose of understanding the impact of these process changes on the distribution of defects. This research not only proposes a method to tackle the well-known issue of B2B current but also provides valuable insight into the steps required to achieve substantial enhancements in the electrical performance of components by fine-tuning BCD process parameters.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10705111/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This study investigates the issue of reducing band-to-band leakage current in low-voltage (LV) CMOS devices realized using BCD technology. Through TCAD simulations and comprehensive experimental characterization, the influence of key process parameters on leakage current in this category of devices is examined. The presented findings suggest that band-to-band tunneling (B2B) can be significantly mitigated by carefully selecting the rapid thermal processing (RTP) annealing temperature. Subsequently, we address the side effects of the modification of the process parameter on the electrical performance of the devices, aiming to recover affected electrical figures of merit through precise adjustments to the process working point. The study shows that this goal can be reached by a proper modification of the p+ implant energy. In the end, a statistical analysis is presented, with the purpose of understanding the impact of these process changes on the distribution of defects. This research not only proposes a method to tackle the well-known issue of B2B current but also provides valuable insight into the steps required to achieve substantial enhancements in the electrical performance of components by fine-tuning BCD process parameters.
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操纵 BCD 技术中低压 pMOS 器件的带间隧道电流:TCAD 和实验研究
本研究探讨了如何降低使用 BCD 技术实现的低电压 (LV) CMOS 器件的带间漏电流。通过 TCAD 仿真和综合实验表征,研究了关键工艺参数对此类器件漏电流的影响。研究结果表明,通过仔细选择快速热处理 (RTP) 退火温度,可以显著减轻带间隧道效应 (B2B)。随后,我们讨论了修改工艺参数对器件电气性能的副作用,旨在通过精确调整工艺工作点来恢复受影响的电气性能指标。研究表明,通过适当调整 p+ 植入能量,可以实现这一目标。最后,还进行了统计分析,目的是了解这些工艺变化对缺陷分布的影响。这项研究不仅提出了解决众所周知的 B2B 电流问题的方法,而且还提供了有价值的见解,让我们了解通过微调 BCD 工艺参数来大幅提高元件电气性能所需的步骤。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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