{"title":"Manipulating Band-to-Band Tunneling Current in Low-Voltage pMOS Devices in BCD Technology: A TCAD and Experimental Investigation","authors":"Guglielmo Albani;Elena Rebussi;Emanuele D’Ambrosio;Annalisa Gilardini;Alessandra Manca;Pietro Miccichè;Daria Doria;Pierpaolo Monge;Elia Sora;Silvia Vangelista;Emanuele Viganò","doi":"10.1109/TED.2024.3466842","DOIUrl":null,"url":null,"abstract":"This study investigates the issue of reducing band-to-band leakage current in low-voltage (LV) CMOS devices realized using BCD technology. Through TCAD simulations and comprehensive experimental characterization, the influence of key process parameters on leakage current in this category of devices is examined. The presented findings suggest that band-to-band tunneling (B2B) can be significantly mitigated by carefully selecting the rapid thermal processing (RTP) annealing temperature. Subsequently, we address the side effects of the modification of the process parameter on the electrical performance of the devices, aiming to recover affected electrical figures of merit through precise adjustments to the process working point. The study shows that this goal can be reached by a proper modification of the p+ implant energy. In the end, a statistical analysis is presented, with the purpose of understanding the impact of these process changes on the distribution of defects. This research not only proposes a method to tackle the well-known issue of B2B current but also provides valuable insight into the steps required to achieve substantial enhancements in the electrical performance of components by fine-tuning BCD process parameters.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10705111/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the issue of reducing band-to-band leakage current in low-voltage (LV) CMOS devices realized using BCD technology. Through TCAD simulations and comprehensive experimental characterization, the influence of key process parameters on leakage current in this category of devices is examined. The presented findings suggest that band-to-band tunneling (B2B) can be significantly mitigated by carefully selecting the rapid thermal processing (RTP) annealing temperature. Subsequently, we address the side effects of the modification of the process parameter on the electrical performance of the devices, aiming to recover affected electrical figures of merit through precise adjustments to the process working point. The study shows that this goal can be reached by a proper modification of the p+ implant energy. In the end, a statistical analysis is presented, with the purpose of understanding the impact of these process changes on the distribution of defects. This research not only proposes a method to tackle the well-known issue of B2B current but also provides valuable insight into the steps required to achieve substantial enhancements in the electrical performance of components by fine-tuning BCD process parameters.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.