Sub-60 mV/Decade Dynamic Subthreshold Swing in Bulk Negative Capacitance Junctionless MOSFET

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-10-01 DOI:10.1109/TED.2024.3462373
Ruma S. R.;Manish Gupta
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Abstract

Through well-calibrated simulations, this work provides physical insights into the occurrence of dynamic sub-60 mV/decade switching in a negative capacitance (NC) junctionless (JL) transistor designed on a bulk substrate. Recognizing that the location of the conduction channel is a key factor governing the matching between ferroelectric and gate capacitances, we showcase the outperformance of bulk NCJL transistors compared to NCJL devices designed on a silicon-on-insulator (SOI) substrate. Results highlight that NCJL transistors designed with relatively higher bulk doping can achieve better dynamic ${S}_{\text {swing}}$ along with a higheron-to-off current ratio. We also investigate the short-channel performance comparison of bulk and SOI NCJL transistors. The results demonstrate the superiority of bulk NCJL transistors due to the enhanced NC effect resulting from the better ferroelectric and gate capacitances matching. The work provides a new viewpoint for designing of NCJL transistor on bulk substrate to facilitate steep ${S}_{\text {swing}}$ at scaled gate lengths.
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块状负电容无结 MOSFET 中低于 60 mV/Decade 的动态次阈值波动
通过校准良好的模拟,这项工作提供了对在体衬底上设计的负电容(NC)无结(JL)晶体管发生 60 mV/decade 以下动态开关的物理洞察。我们认识到传导沟道的位置是影响铁电和栅极电容之间匹配的关键因素,因此与在硅绝缘体(SOI)衬底上设计的 NCJL 器件相比,我们展示了块状 NCJL 晶体管的优异性能。结果表明,采用相对较高的体掺杂设计的 NCJL 晶体管可以获得更好的动态 ${S}_{text {swing}}$ 和更高的导通-关断电流比。我们还研究了体式和 SOI NCJL 晶体管的短沟道性能比较。结果表明,由于更好的铁电和栅极电容匹配增强了 NC 效应,因此体态 NCJL 晶体管更具优势。这项研究为在体衬底上设计 NCJL 晶体管提供了一个新的视角,从而有助于在按比例栅极长度下实现陡峭的 ${S}_{text {swing}}$。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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