Na Li , Shichang Qiao , Xinyu Gao , Fengzhen Wang , Xin Wen , Zhikang Xia , Yongqiang Wang , Shuai Liu , Jinzhe Jiang , Chao Yuan , Yuanbao Shi
{"title":"Unraveling dynamic recrystallization mechanisms in Ni-based wrought superalloy GH4698 through comprehensive EBSD analysis","authors":"Na Li , Shichang Qiao , Xinyu Gao , Fengzhen Wang , Xin Wen , Zhikang Xia , Yongqiang Wang , Shuai Liu , Jinzhe Jiang , Chao Yuan , Yuanbao Shi","doi":"10.1016/j.matlet.2024.137613","DOIUrl":null,"url":null,"abstract":"<div><div>A comprehensive examination of dynamic recrystallization (DRX) mechanisms in wrought superalloy GH4698 has been conducted, leveraging Gleeble thermal simulation experiments and advanced Electron Backscatter Diffraction (EBSD) characterization techniques. Rigorous analysis elucidates four distinct recrystallization processes: Discontinuous Dynamic Recrystallization (DDRX), instigated by strain-induced boundary migration (SIBM); Continuous Dynamic Recrystallization (CDRX), characterized by progressive lattice rotation; Particle Stimulated Nucleation (PSN), driven by the Zener pinning effect of MC-type carbides; and Twin-induced Dynamic Recrystallization (TDRX), facilitated by the interaction between twin boundaries and existing dislocations.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"378 ","pages":"Article 137613"},"PeriodicalIF":2.7000,"publicationDate":"2024-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24017531","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
A comprehensive examination of dynamic recrystallization (DRX) mechanisms in wrought superalloy GH4698 has been conducted, leveraging Gleeble thermal simulation experiments and advanced Electron Backscatter Diffraction (EBSD) characterization techniques. Rigorous analysis elucidates four distinct recrystallization processes: Discontinuous Dynamic Recrystallization (DDRX), instigated by strain-induced boundary migration (SIBM); Continuous Dynamic Recrystallization (CDRX), characterized by progressive lattice rotation; Particle Stimulated Nucleation (PSN), driven by the Zener pinning effect of MC-type carbides; and Twin-induced Dynamic Recrystallization (TDRX), facilitated by the interaction between twin boundaries and existing dislocations.
期刊介绍：
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
