Thiazole-based flame retardant for polyamide vs. a sulfur-free flame retardant with similar phosphorus and nitrogen content

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Chemistry and Physics Pub Date : 2024-10-15 DOI:10.1016/j.matchemphys.2024.130043
Harald Rupp, Jason Ullmann, Kshitij S. Shinde, Anke Schadewald
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Abstract

Polyamides are a promising candidate for the research of sulfur-containing flame retardants (FR). A new material based on 2-aminothiazole and 2-methyl-1,2-oxaphospholane-5-on-2-oxide is prepared and introduced into polyamide 12. To understand the effect of sulfur incorporation in its molecular structure, the new flame retardant is compared to a sulfur-free counterpart, revealing distinct variations in their self-extinguishing characteristics. The higher concentration of heteroatoms results in more flame diluting volatiles in the gas phase during thermal decomposition. The addition of the novel flame retardant containing phosphorus, nitrogen and sulfur, named TP, with only 5 m% into polyamide results in a UL-94 V-0 rating. Simultaneously, the limiting oxygen index increased to 31 %, compared to neat polyamide 12 with 24 %. Remarkably, the moisture absorption remains the same with the thiazole-based FR and the mechanical properties are only slightly decreased. This research reveals the flame retardant capabilities and advantages of a thiazole-based phosphorus compounds in polyamide.

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聚酰胺用噻唑基阻燃剂与磷氮含量相似的无硫阻燃剂的比较
聚酰胺是研究含硫阻燃剂(FR)的理想候选材料。我们制备了一种基于 2-氨基噻唑和 2-甲基-1,2-氧磷杂环戊烷-5-on-2-氧化物的新材料,并将其引入聚酰胺 12 中。为了解在其分子结构中加入硫的影响,将这种新型阻燃剂与不含硫的对应材料进行了比较,结果发现它们的自熄特性存在明显差异。杂原子浓度越高,热分解过程中气相中的火焰稀释挥发物就越多。将含磷、氮和硫的新型阻燃剂(名为 TP)添加到聚酰胺中,且添加量仅为 5 m%,可达到 UL-94 V-0 级。同时,与纯聚酰胺 12 的 24% 相比,极限氧指数增加到 31%。值得注意的是,噻唑基阻燃剂的吸湿性能保持不变,机械性能仅略有下降。这项研究揭示了聚酰胺中噻唑基磷化合物的阻燃能力和优势。
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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